Used LAM RESEARCH 4520 #9029728 for sale

LAM RESEARCH 4520 Asher / Etcher is an advanced, precise, vacuum wafer processing tool used in the fabrication of integrated circuits and other electronic devices. The equipment is capable of producing a variety of materials such as poly-silicon, polyimide, chrome, low-k dielectric and doped-oxide films. 4520 utilizes a etching system with a very fast and accurate scanning tank coupled with a motion control unit that allows for precise, repeatable processes. The scanning tank includes high velocity inert gas, which guarantees good repeatability, uniformity, and throughput. The LAM also features a two-stage plasma source that delivers fast and robust etching with low temperature induced sputtering, deep anisotropic etching and excellent desmear qualities. The plasma source is highly compact and has variable power for consistent and repeatable processes. LAM RESEARCH 4520 also features an adjustable substrate temperature control machine that provides precision thermal management throughout the wafer processing cycle. An integrated tunnel shower allows rapid processing time while providing efficient cooling and temperature control. The tool also offers a number of optional process enhancing options such as inert gas pressure monitoring and plasma characterization and etching potential surveillance. 4520 also has built in software for monitoring the performance of the asset and provide real-time feedback of the various process parameters. This allows for the process to be constantly monitored, adjusted and optimized in order to maximize yields and quality of the final product. Additionally, the software provides recipes for the various etching processes, which provide ideal conditions for every single individual process to be performed. LAM RESEARCH 4520 is a precision etching and ashing tool optimized for the production of advanced integrated circuit and other microelectronic devices. The model is designed for fast and accurate processing of various materials and utilizes a two-stage plasma source for providing both fast and deep etching and excellent desmear performance. The adjustable substrate temperature control equipment and integrated tunnel shower provide an ideal environment for up to 6-inch wafers. A variety of process enhancing options provide a repeatable, reliable and highly efficient process. The integrated software provides real-time feedback and process optimization to ensure yield and quality of the final product.