Used LAM RESEARCH 4528 #9136807 for sale

LAM RESEARCH 4528
Manufacturer
LAM RESEARCH
Model
4528
ID: 9136807
Etcher Single chamber Auto load-unload Turbo pump Dry pump Use gas: SF6, CF4, Ar, CHF3, N2 Gas supply system.
LAM RESEARCH 4528 Asher/Etcher is an automated plasma etching workstation device intended for use in semiconductor manufacturing. The machine is designed for precision plasma etching and director removal with repeatable results. It features a multi-zone, high-resolution, self-compensation endpoint detection equipment. This unit is capable of operating in either low frequency or high-frequency mode. The device is constructed with a swing arm and two-stage vacuum system that includes a high temperature, stand-alone chamber. The vacuum unit provides sealable and purgeable vacuum operations to provide a safe environment for operations, allowing contamination-free operations and processes. It also features an active circular target chuck with RF yoke. 4528 supports a wide range of process capabilities. It is capable of etching up to 350 mm wafers. It features an advanced first-step etch machine and is configured with multiple sets of independent gas injectors. The advanced first-step etch helps improve etching repeatability and consistency. It also has a long-term stability tool for reliable etching and in-situ resource recovery for water and chemical recycling. Additionally, the device is capable of a high plasma inert gas flow for consistent etch-rate control. The device is equipped with a comprehensive automation asset for the procession and handling of wafers. It features an IQ/OQ/PQ model for routine operations and autoverification. Automation features include Wafer Mapping, cassette-to-cassette tray transfer, mini-environment mode, and quick process monitoring. The device also incorporates an automated priming equipment for maintenance and process start-up time reduction. LAM RESEARCH 4528 is designed to support a wide array of recipes and processes, including standard etching, mixed species etching, anisotropic/isotropic etching, deep etching, resist strip, and deep clean. It supports various etching gases, such as oxygen-based, fluorocarbon-based, inert-based and chlorine-based. It also has a low system total cost of ownership and low process complexity. It is manufactured in accordance with semiconductor cleanroom standards and is the most sought-after workstation for etching work.
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