Used LAM RESEARCH 490 #293771117 for sale
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LAM RESEARCH 490, also known as an etch asher, is a equipment designed for plasma etching and passivation of semiconductor materials. It can be used to produce custom, intricate features in a wide range of substrates while achieving a very high level of accuracy, repeatability and process control. 490 utilizes plasma technology to etch and deposit thin layers of material on the substrate, creating a distinct, etching pattern. The system can be used for various materials such as silicon, gallium arsenide, and alumina. The unit includes an electron cyclotron resonance (ECR) plasma source, a radio frequency (RF) power supply, and a chiller to control the reaction chamber temperature. The ECR plasma source allows for a highly uniform plasma, ensuring a uniform etch depth over all areas of the substrate, while the RF power supply provides the necessary power to initiate the process and regulate the plasma parameters to ensure the correct rate of etching. The temperature control further helps to ensure uniform results. LAM RESEARCH 490 provides several features that enable it to perform a variety of etching tasks accurately and with high precision. For example, the machine is equipped with an auto tuning feature that allows for easy optimization and control of the process parameters to the type of substrate being processed. Additionally, the tool includes a sensor asset to monitor and regulate critical variables such as pressure, temperature and electrical fields. This feedback loop helps to ensure the process runs at optimal efficiency. The model also includes a wide variety of interchangeable components and accessories, allowing for use with a wide range of materials and applications. These include a wafer lift equipment, end effector, thermal chuck, and user-programmable etch rates. In addition, 490 can also be equipped with an autosampler, enabling it to process multiple wafers in succession. In summary, LAM RESEARCH 490 is an etching system designed to provide custom, intricate features on a variety of substrates. It is equipped with an ECR plasma source, a RF power supply, an auto tuning feature, a sensor unit, a wafer lift machine, an end effector, a thermal chuck, and user-programmable etch rates to ensure accuracy, repeatability and process control. Additionally, an autosampler allows the tool to process multiple wafers in succession.
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