Used LAM RESEARCH 490 #9262860 for sale

LAM RESEARCH 490 is an etcher/asher equipment engineered to meet the needs of the most demanding applications. With its state-of-the-art capabilities and performance, 490 system is a highly sophisticated etching and ashing tool for semiconductor applications. LAM RESEARCH 490 has a large number of features, all tailored to help deliver superior etch and ashing features. An enhanced wafer robot, with an advanced capability for wafer handling, ensures less wafer scratching, while the integrated wafer handling unit helps to reduce the risk of chip damage. For etching, 490 machine uses an innovative, thermal controlled Plasma Uniformity control tool (PUC) to fine tune and control etch parameters for best results on a variety of materials and substrates. Additionally, LAM RESEARCH 490 asset includes a unique substrate-configurable pre-clean process module (PCPM) to optimize process residues on various substrates. The robust control model of 490 equipment ensures a high degree of wafer-to-wafer repeatability and reproducibility. This helps to minimize tool and user dependent variations while optimizing productivity. The process control software included with LAM RESEARCH 490 system is designed to help users to optimize etching, profile, and linearity performances, while providing the ability to view real-time and process logs. 490 unit also comes equipped with an advanced safety monitoring and control machine (SMSC) which drastically reduces the chances of any accidents or mis-processing of wafers by allowing the operator to intervene and take corrective action when required. Furthermore, the tool provides a built-in maintenance module that assists users in tracking and managing maintenance records and scheduling maintenance intervals, helping to ensure that the asset is well maintained and running trouble free. To take advantage of the best etching performance, LAM RESEARCH 490 includes a high-end RF generator and a wide range of plasma options. The advanced RF generator allows for maximum flexibility and control over the etching process by providing a wide range of RF power levels. Additionally, the model features several advanced options, such as multi-wafer etch and ultra-low gap etch for fine tuning process parameters to best ensure process uniformity. In summary, 490 equipment exemplifies advanced etching and ashing capabilities with its excellent uniformity and superb product safety, plus a wide range of powerful capabilities. As such, the system is a perfect choice for semiconductor applications with demanding etching requirements.