Used LAM RESEARCH 839-102001-069 #293646530 for sale
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LAM RESEARCH 839-102001-069 is an advanced plasma etcher/asher developed for complete wafer-level manufacture. The 839 model is an automated tool specifically designed to precisely etch and asher portions of a semiconductor wafer. The systems advanced control system is composed of many monitors and user-defined controls to allow for easy operation and precise parameter settings. The 839 model consists of two processing units housed within a single cabinet. The main unit is comprised of a 300mm capacitively coupled plasma reactor containing a matching network and coil load, a scanning electrostatic chuck, and a planar RF generator for wafer-level etching. The second unit houses the load lock and the load/unload arm system for added convenience and precise handling of product. The 839 model utilizes a planar antenna driven by a 1.7kW, 13.56MHz RF generator to transport ions at precise energies and densities. The unit also has a computer-controlled, multi-zone gas injection system which monitors flow rates and temperatures, providing precise control of the etch profile and improved repeatability. The etch process begins by loading a wafer onto the scanning electrostatic chuck which extends the wafer out over the surface of the process chamber via electrostatic forces. The RF generator then appropriately energizes the planar antenna, creating a sheath of electron-ionized plasma between the antenna and the wafer's surface. An ion flux then begins to be applied to the wafer, aiding the etching process. After the desired etch profile is achieved, a purge gas is then introduced to the reactor which shuts off the plasma and terminates the etch process. The purge gas also helps contain the large volume of particles from the etching process, as particles must be carefully monitored to maintain cleanliness on a wafer's surface. The unit also offers an ash process to clean the plasma-facing surfaces of the wafer and remove any surface damage caused by etching. The ash process is similar to the etch process and utilizes the same RF generator and purge process. 839-102001-069 is an advanced etching/ashing modular process solution offering precise, high-performance capability with minimal maintenance and minimal operator oversight.
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