Used LAM RESEARCH Alliance 4.1 #9182311 for sale

ID: 9182311
Wafer Size: 6"
Vintage: 1996
Etcher, 6" (3) System monitors TM LID: Cylinder open/close (manual type) Wafer present sensors (WPS) TM & VCE Pump option: Single pump type Fab clean room configuration: Bulkhead Robot: BROOKS / MTR 5 / (2) Blades Aux position 1: Aligner Transport system control: Transport VME Multiplexer PCB Load lock: Auto door VCE Elevator: Bellows seal Mapping sensor includes Cassette type: (25) Slots VCE Vacuum isolation valves TM Vacuum isolation valves TM Pneumatic valves Chamber position 1: 9400SE, 6" Chamber process: Poly Turbo pump: SEIKO SEIKI STP-A1303 VAT 65 Pendulum valve RF Generator TCP: ADVANCED ENERGY RFG1250 13.56MHz RF Generator bottom: ADVANCED ENERGY Halo 1250 13.57MHz Chamber position 2: 9400SE, 6" Chamber process: Poly Turbo pump: SEIKO SEIKI STP-A1303 (Turbo missing) VAT 65 Pendulum valve (VAT Valve controller missing) RF Generator TCP: ADVANCED ENERGY RFG1250 13.56MHz Chamber position 3: 9400SE, 6" Chamber process: Poly Turbo pump: SEIKO SEIKI STP-A1303 (Turbo controller missing) VAT 65 Pendulum valve (VAT Valve controller missing) RF Generator TCP: ADVANCED ENERGY RFG1250 13.56MHz Missing part: Position 2 / 3: RF Generator bottom: ADVANCED ENERGY Halo 1250 13.57MHz 1996 vintage.
LAM RESEARCH Alliance 4.1 is an etching or ashing equipment, designed specifically for the fabrication of electronic and semiconductor components. It is an advanced platform for the deposition of multiple features on single or multiple substrates. Alliance 4.1 features a high-performance, cost-effective, and technically advanced etching chamber. It delivers robust and reliable etch process performance for a wide variety of processes, materials, and applications. The Alliance 4.1's superior etching capability allows for deposition of features with market-leading precision and high accuracy. This is achieved through its advanced upper and lower electrode structures and the use of precise material-management systems. The system utilizes an inverted angle substrate orientation to ensure a precise etching result. In addition, the Alliance 4.1 has an integrated user interface with advanced control capabilities. The unit is designed to allow users to easily interact with the etching chamber, including programming the specific parameters of the etching process. This advanced control machine can be used to ensure that the desired results are achieved while meeting the cost and process objectives. The Alliance 4.1 features an ultra-thin film precision etching chamber with the capacity to produce features smaller than 5 nanometers. It also provides etching processes that are suitable to meet high-precision needs, while maintaining cost efficiency. Additionally, the Alliance 4.1 etching chamber is designed to provide optimal performance and reliability with minimal maintenance needs. The tool's design enables rapid reaction to process changes and ensures repeatable process results. Furthermore, the asset's maintenance requirements are minimal, making it an excellent choice for cost-sensitive applications. In conclusion, LAM RESEARCH Alliance 4.1 is a cost-effective and high-performance etching model, providing the ability to deposit multiple features on single or multiple substrates with market-leading precision and accuracy. Its integrated user interface and advanced control equipment provide the ability to precisely program the etching space and ensure that the required results are achieved. As a result, the Alliance 4.1 is an excellent choice for high-precision, cost-sensitive applications.
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