Used LAM RESEARCH Alliance A4 #9195947 for sale

LAM RESEARCH Alliance A4 is an etcher/asher equipment designed to provide advanced etching solutions for the fabrication of various types of semiconductor devices. This system is equipped with two independently controllable plasma processing chambers, the main chamber containing a planar source and an auxiliary chamber used for in situ cleaning and/or additional etch treatments. The planar source provides excellent uniformity of the plasma density, allowing for accurate etching of semiconductor devices with high precision and repeatability. Additionally, the unit is equipped with a reaction cooling chamber, which ensures optimal thermal control during the etching process. Alliance A4 utilizes a unique high-density plasma source, which is capable of producing a uniform plasma density across the wafer surface. This enables the plasma to reach the entire wafer surface during the etching process, resulting in high arced etching and high wafer uniformity. Additionally, LAM RESEARCH Alliance A4 utilizes iVPD™ MassFlow™, a patented mass flow controller technology that regulates the process gases and optimizes the distribution of the etchant to the wafer surface. This ensures precise material etching rate and accurate thickness control throughout the etching process. Alliance A4 also features an integrated wafer transport machine which transports the wafers between the main chamber and the auxiliary chamber for cleaning and additional etch treatments. The auxiliary chamber is equipped with a second high-density etch source as well as an additional frequency source, which can be used for additional etching, cleaning, or priming of the wafer. The integrated transport tool ensures precise alignment of the wafer and optimal wafer handling, enabling consistently high-quality etching performance. LAM RESEARCH Alliance A4 is designed to meet a wide range of process requirements and is suitable for various etching applications, including deep reactive ion etching (DRIE), plasma etching, and surface passivation. Additionally, it features a range of advanced process control capabilities, including advanced process monitoring, Remote Chamber Diagnostics (RCD), and an RF power monitor with real-time feedback. The combination of these advanced features allows for maximum process control and reliable processing performance.