Used LAM RESEARCH C360 #293757224 for sale

Manufacturer
LAM RESEARCH
Model
C360
ID: 293757224
Wafer Size: 12"
Etcher, 12" Process flow: HF.
LAM RESEARCH C360 is a cutting-edge etcher/asher equipment designed for advanced semiconductor manufacturing processes. This system combines innovative technology with precision control to deliver high-performance results for critical etching and ashing applications in the semiconductor industry. At the heart of C360 unit is its advanced plasma processing technology, which allows for precise and uniform removal of material from semiconductor wafers. The machine features multiple plasma sources, such as inductively coupled plasma (ICP) sources and capacitively coupled plasma (CCP) sources, which provide flexibility in process tuning and optimization for a wide range of materials and device structures. LAM RESEARCH C360 is equipped with a highly configurable chamber design that allows for customization of process conditions to meet the specific requirements of different etching and ashing applications. The chamber features a dual-zone temperature control tool that enables precise control of wafer temperature during processing, ensuring optimal process performance and uniformity. The asset also incorporates advanced gas delivery and mixing capabilities, with multiple gas inlets and mass flow controllers that enable precise control of gas flow rates and compositions. This ensures consistent plasma chemistry and etch/ash rates across the wafer surface, resulting in high quality and reliable process results. In addition to its advanced plasma processing capabilities, C360 model also features a state-of-the-art wafer handling equipment, designed for high throughput and automation. The system is equipped with a robotic wafer handler that enables seamless loading and unloading of wafers, as well as automatic wafer mapping and detection for process control and monitoring. To ensure process reliability and repeatability, LAM RESEARCH C360 unit is equipped with advanced process monitoring and control capabilities. The machine features real-time endpoint detection technologies, such as optical emission spectroscopy (OES) and laser interferometry, that allow for precise control of etch and ash processes, as well as early detection of process deviations. Moreover, the tool is equipped with advanced software capabilities, including recipe management and process optimization tools, that enable users to easily setup and optimize etching and ashing processes for maximum efficiency and performance. The asset also features remote diagnostic and support capabilities, allowing for rapid troubleshooting and issue resolution to minimize downtime and ensure optimal model performance. Overall, C360 etcher/asher equipment is a sophisticated and advanced solution for semiconductor manufacturers looking to achieve high-performance results in critical etching and ashing applications. With its innovative technology, precision control, and advanced automation features, the system offers superior process performance, reliability, and flexibility for a wide range of semiconductor manufacturing processes.
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