Used LAM RESEARCH Chambers for 2300 Exelan Flex #9393585 for sale

LAM RESEARCH 2300 Exelan Flex Etcher/Asher is designed with advanced etching and ashing techniques in mind. This innovative chamber from LAM RESEARCH provides maximum process coverage and flexibility in both wet and dry etching and ashing processes. This chamber includes advanced technology such as three-dimensional plasma that supports cryogenic etching and desmear, deep reactive ion etching, and plasma ashing. It also has an automated process door that ensures quick and easy access to samples without the need for manual alignment. The chamber also has a low of 75 torr and a pressure range of 1 to 2 milliTorr. The 2300EXP is equipped with several features designed to maximize process yield and reduce downtime. Features include a uniformity control feature that ensures uniform processes across large-area substrates and a process exhaust system that allows rapid venting of the chamber to the desired pressure once the wafer is ashed. The 2300 Exelan Flex's features also include a metal-seal hose connection, an inert film heaters, multi-armed electrostatic chucking, and capability for cryogenic processes. It has an automatic retractable arm support, an inert gases panel, automatic gas valves, and a wafer alignment cake. The chamber also includes automated gas, plasma, and wafer handling systems that allow fast, efficient process execution. A built-in process monitoring system allows for error checking and can detect etch and ashing rate fluctuations and process instabilities. Samples can also be monitored and checked for any irregularities or defects prior to completion. The overall chamber size is 26" w x 32" d x 35" h and the chamber has the capability to process eight 2" wafers or four 4" wafers. It is compatible with many different plasma sources, including inductively coupled plasmas, radio frequency, and bias plasmas. The chamber's total gas input is 1.4 liters/minute. Overall, the 2300 Exelan Flex from LAM RESEARCH is an advanced etcher/asher that combines flexibility and versatility with reliable and consistent process control. This unit can accommodate a wide range of etching and ashing recipes and provides excellent uniformity and reliability for multi-step processes of both wet and dry etching and ashing.