Used LAM RESEARCH / DRYTEK DRIE-100 #9093529 for sale

LAM RESEARCH / DRYTEK DRIE-100 is an industrial etcher and asher used in semiconductor fabrications. The equipment is designed for high precision, uniform etching of a wide range of substrates including silicon, quartz and polymers. DRYTEK DRIE-100 features a low-pressure, high-density plasma source generating plasma in a C2F6/O2/SF6 mixture to etch and ash both prime and susceptor wafers in an enclosed chamber. The system utilizes the Deep Reactive Ion Etching (DRIE) process, which utilizes a combination of dry etching chemistry with ion bombardment to create high-fidelity etch profiles with selectivity ratios up to 1:1000 and aspect ratios up to 2:1 in photoresists, quartz, silicon and a range of other materials. LAM RESEARCH DRIE-100 can process up to four 200mm prime wafers or two 300mm prime or susceptor wafers in one batch cycle, enabling high-throughput etching and ashing processes. The process is a batch-by-batch unit where each batch is placed in the vacuum chamber and has separate control systems, allowing for precise and independent control of pressure, gas flow, temperature and RF power. The machine features an automated forced gas purge technique to eliminate particle contamination from the plasma chamber. This gas-purging process isolates each processing chamber from the others, allowing each batch to be treated independently. For optimal etching and ashing performance, DRIE-100 has a variable temperature design with a built-in RF generator and matching circuit for power delivery to the coil. The temperature is controlled by a programmable temperature controller, and the RF power output is adjustable throughout the cycle to optimize etch processes. An independent mechanical arm is used to transfer wafers from cassette to the processing chamber, ensuring repeatable transfer steps for etching and ashing. LAM RESEARCH / DRYTEK DRIE-100 features a series of advanced diagnostics and safety systems that monitor the tool and ensure reliable performance. This includes an integrated viewing asset using a thermal imaging camera as well as a pressure alarm model that monitors the chamber pressure to ensure optimal etching conditions. Additionally, the equipment has a closed-loop plasma etch monitor that provides feedback information regarding etching processes. This includes real-time data regarding etch rates, applied power and process results. DRYTEK DRIE-100 is designed to provide reliable and repeatable etching and ashing performance with the highest accuracy and precision. The system features state-of-the-art diagnostics, safety protocols, and control systems that enable the device to operate with maximum efficiency and productivity. The unit can be used in a broad range of nanostructuring fabrication processes, offering superior choice for fabrications involving high-precision etching and ashing of both prime and susceptor wafers.