Used LAM RESEARCH Exelan HPT #195406 for sale

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ID: 195406
Wafer Size: 8"
Vintage: 2001
Oxide etcher, 8" (3) Chambers Configuration: Transfer Module: A6 VCE: L-VCE : Brooks 004-9200-24 R-VCE : Brooks 004-9300-24 Robot: BROOKS, Magnatran7, Model 002-4037-02 PM-1: EXELAN HPT PM-2: EXELAN HPT PM-3: EXELAN HPT Aligner: present Aligner Controller: Model 001-4130-03 User Interface: CRT Monitor, PC, Keyboard, Signal Tower Gas Box: Standard 8-Channel (With GIB) TMP-PM1: ALCATEL ATH1600M TMP-PM2: ALCATEL ATH1600M TMP-PM3: ALCATEL ATH1600M RPM: 685-495112 Main-Power UPS-Power Signal Tower: 3-Color (red, green, yellow) EMO: Push Button Arm type: twin arm Lid lifter: present Wafer Detection System EMO Hub Cable receways Facilities Distribution PM Gate Valves: 853-442064-002 TM Vacuum Valve: 796-095595-001 VCE Vacuum Valve: 796-094747-002 Module Configuration(M/D,P/N,S/N) Process module type: Exelan HTP One Box: ENI Parts NO : OB1-R03, LRC Parts NO.: 660-099877R101 CM gauge-1 (process chamber): MILLIPORE, 2Torr CM gauge-2 (manifold chamber): MKS, 10Torr Turbo pump: ALCATEL, ATH1600M Turbo pump controller: ALCATEL, ACT 1300M/1600M Throttle valve: Pendulum Valve, 65046-PH52-ALQ1 CM gauge-1 (process chamber): MKS, 629A-14608, 0.1Torr CM gauge-2 (manifold chamber): MKS, 625A11TDE, 10Torr CM gauge-3 (foreline): MKS, 625A11TDE, 10Torr Turbo bypass valve: - Turbo exhaust valve: Present Slot valve: Present, 853-442064-002 Endpoint detector: 4-CH(A-390nm, B-480nm, C-440nm, D-400nm) Cooling He MFC: MKS Type649 Turbo Pressure Switch - 1: Present Turbo Pressure Switch - 2: Present Chamber Vacuum Switch: Present Chamber ATM Switch: Present Gas No Gas Name Range Model 1 AR 1L UNIT, UFC-8161 2 N2 200CC UNIT, UFC-8161 3 O2 50sccm UNIT, UFC-8161 4 CF4 100sccm UNIT, UFC-8161 5 CHF3 50CC UNIT, UFC-8161 6 O2 20CC UNIT, UFC-8161 7 CH2F2 50sccm UNIT, UFC-8161 8 C4F8 20CC UNIT, UFC-8161 Chamber Parts - Bad ESC - Bad (Crack & Chipping) 2001 vintage.
LAM RESEARCH Exelan HPT is an etcher / asher systems that is designed to meet and exceed the performance requirements for high-precision etching and ash processing of most advanced semiconductor devices. It is used in applications such as MEMS devices, integrated circuits, and other novel devices. The equipment uses high precision, automated process control features that enable high throughput, outstanding processing uniformity, and excellent process repeatability. Exelan HPT consists of a multi-tank processing module, an elevated load lock, an interface chamber, a wafer handling station, and a vacuum pump. The beauty of this system is that it is offered with an optional integrated automated in-situ cleaning unit to ensure optimal results. The multi-tank module provides up to three processing tanks and a reclaim tank for efficient processing of different types of materials. The dual tank module is available in either single substrate or dual substrate configurations and offers a versatile range of processing modes such as wet/dry etching, wet/dry oxide etching, wet/dry protective coatings, and electroless plating/sputtering. The elevated load lock allows for an improved wafer handling station to provide for improved handling and unloading of the wafers. The interface chamber prevents cross contamination between the substrate and the gases and liquids used in any of the processing steps. The wafer handling station provides for automated wafer transfer between processing tanks, probes, and other peripheral instruments. The versatile LAM RESEARCH Exelan HPT machine also offers a multi-language menu tool for maximum workflow flexibility. This feature allows the operator to program and control the asset according to the specific processing needs of the application. The model also features a number of control features including process monitoring, user-defined recipe control functions, and a range of support functions. The excellent performance of Exelan HPT makes it the equipment of choice for high precision etching and ash processing. The system's flexibility allows for efficient and repeatable etching of a wide range of materials and substrates, enabling high throughput and excellent continuity of processing. This unit is an excellent choice for high-end etching applications in semiconductor device manufacturing.
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