Used LAM RESEARCH Flex 45 #9378664 for sale

LAM RESEARCH Flex 45 is an advanced etch/asper suited for a wide variety of etching and asper applications. It is a single-wafer, multi-plate equipment designed for high throughput, high selectivity etching and asper processes. The system is equipped with powerful Resonant Helicon and Hot Wall ICP etching sources, allowing precise control over process parameters for sophisticated etch recipes. It also features advanced process control software, enabling unmatched process control, from substrate to substrate. Flex 45 can accommodate a wide range of substrates up to 3mm thick, and can perform etching with very high repeatability and precision. It supports throughputs of up to 40 Wafers Per Hour (WPH) as well as complex etch recipes with full process control. The unit also supports processes such as isotropic etching, anisotropic etching, recess etching, photoresist and hardmask etching, and surface features control. The machine's resonant helical source has been designed with proprietary tuning technology that provides adjustable power, waveform, and frequency. This lets users adjust process results such as etch rate, profile shape, process selectivity, asper uniformity, and film sidewall angles. The accompanying ICP source enables processes with very low etch rate and an isotropic etch profile. The resonant helical source also allows for highly uniform etch depth with low and uniform base line etching. The resulting feature depth accuracy can be up to ±1 %. LAM RESEARCH Flex 45 has a wide range of features and options that enable users to tailor the tool to their needs. The Loadlock asset is equipped with a pressure control model, and has atmospheric and high-vacuum options. This allows for quick substrate loading and unloading, while decreasing contamination. The equipment also has a motorized motion control feature for automated substrate clamps, and a variable intensity hot wall etching source designed for advanced etching processes. Flex 45 also offers a direct-write imaging solution, allowing users to write directly onto the substrate. This feature reduces variability by eliminating the need to mask or transfer a reticle, thus allowing users to shave off valuable time while increasing accuracy. The system is compatible with both pneumatic and soft valves for process control, enabling precise control of the process environment. Finally, LAM RESEARCH Flex 45 also provides fully automated digital profiling, traceback and video monitoring capabilities. It has advanced cyclone control, an innovative critical-dimension-monitoring unit, and a digital video-on-demand option that lets users 'watch' the etching progress in near-real time. With its cutting-edge features and process control capabilities, Flex 45 is an ideal etcher and asper for a variety of etching and asper applications.