Used LAM RESEARCH Flex 45 #9407023 for sale
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ID: 9407023
Vintage: 2009
Etcher
(4) Chambers
AC Rack
VTM
RPDB
GIB
Main frame:
Platform type: V2
(3) Load ports
ATM Robot
TM Robot
I-Pump
PM Module:
(4) CPU
(4) VIOP
(4) ESC Power supplies
(4) OES
(4) ESC
Gas:
Gas box type: IGS
(17) Gas lines
(68) Gas boxes MFC
(9) He UPC
Vacuum gauge:
(4) Process vacuum gauges, 0.1 Torr
(4) Chamber vacuum gauges, 1 Torr
(4) Fore line vacuum gauges, 10 Torr
TM Vacuum gauge
(2) Air lock vacuum gauges
(2) Air lock heating gauges
Pump:
(4) Turbo pumps
(4) Turbo pump controllers
RF Generator / Matcher:
(4) RF Generators, 2 MHz
(4) RF Generators, 27 MHz
(4) RF Generators, 60 MHz
(4) RF Cable lengths, 2 MHz
(4) RF Cable lengths, 27 MHz
(4) RF Cable lengths, 60 MHz
2009 vintage.
LAM RESEARCH Flex 45 is an etcher/asher equipment for the semiconductor industry. The system is based on high-density plasma technology, and is designed to etch and clean wafers through high-frequency pulsed power. This enables high-precision patterning of advanced features while maintaining optimal throughput. The unit utilizes LAM's RF distribution network which is designed to ensure the best uniformity in critical etch layers, while providing an environment with maximum process control so as to reduce wafer loss. The machine is equipped with two high-frequency, high-power generators and two ring-style Faraday cage electrodes. The Faraday cage electrodes contribute to ensuring plasma uniformity and predictable etching capabilities, while the two high-frequency, high-power generators allow for precise control over the plasma frequency. This control is crucial for etch processes, as it allows users to tailor the etching process to their specific needs. The tool has an advanced process control and monitoring asset, allowing for accuratewafer tracking and wafer history logging, allowing for easier debugging and optimization. The model is shielded by an air curtain and includes a vacuum equipment for part evacuation, low particle environment and wafer cleaning. Furthermore, the system has a Dry Strip capability, enabling the removal of unwanted photoresist layers from fine structures. The unit is built with a modular architecture to ensure maximum uptime while the operator can easily select or modify the appropriate process recipes. The machine is designed to allow the use of standard hardware components like pumps, power supplies and heaters, to quickly modify and upgrade existing configurations. The tool also features advanced metrology capabilities, offering full integration with automated metrology systems to further optimize the process and develop recipes. Finally, the asset is equipped with automated light-wave mapping capabilities, allowing for superior wafer-to-wafer uniformity. Overall, Flex 45 etcher/asher model is an advanced technology with high-precision etching and cleaning capability, sophisticated process control and monitoring, and optimized metrology capabilities. This equipment is designed to ensure maximum throughput, low particle environments, and high-precision etch layers, making it ideal for use in the semiconductor industry.
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