Used LAM RESEARCH FLEX DS #9315255 for sale

LAM RESEARCH FLEX DS is an advanced etcher and asher chamber designed for use in semiconductor and thin-film processes. It is designed to provide an ultra-high uniformity of etch and ash processes, and can be used for wet etch, dry etch, and ash process. FLEX DS is capable of etching and ashing substrates up to 3 inch in diameter. It features an adjustable gas temperature, pressure and flow. It also has adjustable rotating speed, platen IR sensors and ICP RF power and matching controls. It also includes a remote operation panel for monitoring the process parameters. The chamber is optimized for a wide range of materials including silicon, gallium arsenide and silicon nitride. It features a full Ceramic Ringer for improved etching uniformity. The chamber includes an especially engineered polyimide liner to ensure a uniform and repeatable etch depth. The chamber is designed to be compatible with a wide range of chemistries including SF6, CF4, NF3, C5F8, and He/Xe mixtures for deep-level anisotropic etching. It is also capable of supporting low pressure no-bake processing using high and low pressure exhaust mixtures. LAM RESEARCH FLEX DS features an advanced 5-axis robot for precise wafer handling. The robot is capable of moving wafers from the loadlock to the in-situ chamber, and from the in-situ chamber to the cleanroom. This enables the use of SCARA robots, making it even easier to transfer wafers. The chamber includes a wafer monitoring system, which is designed to monitor the wafer temperature and pressure during the etching and ash-etching processes. This helps to ensure that the process is accurately controlled. The chamber also includes an RF reflectometry system, which helps to monitor the uniformity of the etch profile. FLEX DS is an advanced etching and ashing chamber, designed to provide precise etch and ash processes with ultra-high uniformity. It is capable of etching and ashing a wide range of materials. Its advanced robot for wafer handling makes it easy to transfer wafers, and its RF reflectometry system ensures optimal uniformity of etch process.