Used LAM RESEARCH FLEX DS #9351457 for sale

LAM RESEARCH FLEX DS
ID: 9351457
Vintage: 2010
Etcher 2010 vintage.
LAM RESEARCH FLEX DS is a fully integrated dry etch/ash equipment specifically designed for advanced semiconductor processing applications. FLEX DS system delivers high uniformity, repeatability and throughput to provide the lowest possible wastage while maintaining the highest yield of device production. The unit is a modular unit, capable of delivering multiple process sequences with uniformity and repeatability across each workpiece. It is designed for optimal device yield and productivity, providing superior results in the most challenging lithography and deposition processes. The machine features an advanced etch chamber design that provides a compact footprint, improved thermal uniformity, elevated throughput and optimized process parameters. The chamber is equipped with two integrated 3-D inductively coupled plasma (ICP) sources that provide superior coverage over multiple wafer substrates. The substrate support is also highly adjustable, allowing for the usage of different substrate sizes and shapes. The tool is capable of delivering four independent etch and three deposition processes in one sequence, which reduces process cycle time and improves overall throughput. LAM RESEARCH FLEX DS asset also features direct-drive motor technology for high-precision, repeatable motion control over the entire workpiece. This ensures uniformity of etch rate, uniformity of deposition and uniformity of adhesion. In addition, the model is equipped with advanced metrology and feedback control systems that measure and control both etch and deposition rate in real time. This allows the user to select the optimal process parameters for the workpiece to ensure consistent results. The integrated gas supply equipment also offers precise gas ratio control and the ability to inject different gas mixtures and concentrations. FLEX DS is a complete etch/ash system designed for advanced semiconductor processing, providing superior performance and reliability. It is a cost-effective solution for high-density device fabrication that ensures optimized device yield and productivity.
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