Used LAM RESEARCH FLEX DS #9401893 for sale

ID: 9401893
Vintage: 2009
Etcher Does not include chamber 2009 vintage.
LAM RESEARCH FLEX DS (formerly known as the "FLEX Asher") is an advanced etching / ashing solution that provides precision, repeatable results for a wide range of etching and ashing applications. This platform, designed and manufactured by LAM RESEARCH, leverages advanced control technologies to ensure individual process modules consistently perform within stringent process parameters. This is a critical capability in applications such as semiconductor, memory, and photomask device failure analysis since it eliminates the chances of costly failure due to inconsistent etching or ashing. FLEX DS is a widely configurable platform which provides a capability to support applications ranging from RF Sputtering to high power Plasma Ashing. It is designed to work with a wide range of substrates, from wide range of materials. It offers quick changeover, a 16-position susceptor and wafer platen for wafer cassette to cassette loading, and an automated process discovery feature to ensure user-defined recipes can be tailored for different materials, thickness and materials. The platform employs LAM RESEARCH automated process optimization technology to ensure the highest level of process optimization and repeatability. Automated process optimization technology uses proprietary algorithms to closely monitor and control the process parameters in real-time. This facilitates fine-tuning of the etching or ashing processes, allowing users to achieve the highest levels of precision. LAM RESEARCH FLEX DS also supports advanced cleaning solutions. The automated cleaning- and drying system ensures cleanliness of the surfaces, making it easier and faster to transfer wafers into another module or store them after processing. The platform integrates diagnostics into the system, allowing reliable and efficient troubleshooting of any process issue. Process protocols are stored and verified on the system, ensuring that all outputs are traceable and reliable. In addition to these core capabilities, FLEX DS platform also offers flexibility and versatility. This includes multi-functional modules, programmable motion sequence and wafer transfer for multi-stage processing, and software-controlled parameter settings for maximum process optimization in highly complex applications. With these features, LAM RESEARCH FLEX DS is ideal for research, development and production applications in the semiconductor, memory, and photomask device failure analysis industry.
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