Used LAM RESEARCH FLEX FX EFEM #9270875 for sale

LAM RESEARCH FLEX FX EFEM is a leading-edge etching and ashing equipment designed for precision etching and other related applications. With a powerful advanced design, it is an ideal process tool for a variety of applications, such as high aspect ratio etching, thermal nano-etching, and plasma nano-etching. It includes an integrated vacuum-assist capability for improved process repeatability. FLEX FX EFEM platform is specifically designed to handle the requirements of today's advanced etching and ashing applications. LAM RESEARCH FLEX FX EFEM's advanced design can handle a wide range of high etch aspect ratios, large areas, and tight image registration accuracy with high repeatability. It also features a powerful closed loop control system that continuously monitors and maintains process parameters to meet or exceed process requirements. This allows the unit to achieve the highest standards of performance. FLEX FX EFEM also contains an onboard powerhouse of etching tools and processes. Its multiple layers of materials can range from metals, ceramics, and insulators to organic and semiconductor materials. This wide range of materials provides the user with the flexibility to process different wafers with the assurance of achieving high levels of precision each time. Additionally, the machine's advanced design integrates protection and cleaning systems to guarantee an environment suitable for the best possible etching and ashing processes. LAM RESEARCH FLEX FX EFEM also includes other specialty features to meet unique requirements. A patented plasma line- and grid-angle distribution optimizes plasma reactivity for the highest levels of etching precision and repeatability. It also features advanced process control with user-defined setting inputs for superior control of process parameters. Overall, FLEX FX EFEM is an advanced etching and ashing tool with high-end features and capabilities. Its powerful design and multiple layers of materials allows the user to etch different wafers with assurance of precise and repeatable results. Its onboard protection and cleaning systems assure a high-quality process environment, while its process control and specialty features provide total process control and ensure the highest levels of etching and ashing precision and repeatability.