Used LAM RESEARCH Inova next #9144982 for sale

LAM RESEARCH Inova next
ID: 9144982
Vintage: 2012
PVD Chambers, 2012 vintage.
LAM RESEARCH Inova next is an advanced etcher/asher used in the manufacturing of semiconductor devices. It is an electro-chemical etching technique that allows for precise control of the etching process, enabling the fabrication of complex vertical structures. It is a cost-effective and reliable solution for etching dielectric layers, metal tracks, and advanced micron level structures in device fabrication. Inova next features a wide range of etching processes, including wet chemical, stream etching, reactive ion etching (RIE) and an advanced anisotropic etching technology. The etcher can handle wafers up to 150mm in diameter. It features a special ring shaped high aspect ratio chamber that provides optimized etching performance for deep micron-level structures. LAM RESEARCH Inova next features an easy-to-use software suite for etching process control and recipe development. It maintains excellent repeatability and uniformity of the etching result and provides an optimal etching temperature. The software also supports semiconductor process control such as temperature mapping, pressure regulation, gas flow and monitoring of feed rates and materials. The etcher/asher has a sophisticated optical system, which allows for fast tuning and high resolution imaging of the etching results. It is equipped with accurate profiling systems to monitor the etching depth and structure width, allowing for optimized etching results. Inova next is user-friendly and reliable. The system has numerous safety features and is compliant with current environmental regulations. The etcher/asher is capable of handling a wide range of materials, enabling chip manufacturers to develop complex structures at high throughput. LAM RESEARCH Inova next is an advanced and reliable etcher/asher designed specifically for chip fabrication. It features powerful process control and advanced etching technologies to produce high quality structures with accuracy and uniformity. The system is user-friendly, cost-effective and compliant with the latest environmental regulations.
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