Used LAM RESEARCH Kiyo45 Poly #9137311 for sale

LAM RESEARCH Kiyo45 Poly is a low pressure etching/ashing equipment designed primarily for the semiconductor and MEMS industry. It is optimally suited for applications such as high precision polysilicon etching, via etching, shallow trench isolation (STI) etching, contact hole etching, passivation layer etching and waveguide etching. The system makes use of a novel, patented, high aspect ratio etching (HARI) technology which integrates a gas manifold and showerhead in a single, integrated unit. The unit is capable of providing long, uniform etching times at very low gas pressures and without damaging the device surface. This contributes to very high device yields and repeatability. This machine can be configured for either batch, inline, or standalone configuration, with a range of process chamber sizes and configurations. Kiyo45 Poly is designed to provide flexibility across a variety of applications and substrates. A key feature of the tool is its highly accurate and controllable power delivery asset. This allows the user to achieve very reproducible process results with excellent profile control for polysilicon etch applications. The power source is able to generate a maximum of 2000W for superior polysilicon etch results. Additionally, LAM RESEARCH Kiyo45 Poly can be operated with either atmospheric pressure or low pressure capabilities and can be operated from 1500-2000W. The model is also equipped with the latest in plasma control technology. It employs a distributed magnetic field (DMF) to provide improved etch performance, repeatability and uniformity. The DMF is designed to maximize etch uniformity over the entire wafer surface and also effectively reduce oxygen contamination and particle formation. This is done by increasing sputtering efficiency and controlling electrode erosion. The DMF also optimizes the distribution of etch process gases across the wafer surface, improving the etch rate across the entire wafer. In addition, the equipment provides stable and accurate control over the pressure and flow of the process gases. The process gas flow is precisely controlled by the on-board mass flow controllers which are automatically tuned to the process parameters. Also, the unique design of Kiyo45 Poly integration system makes it possible to easily upgrade the unit. This means that the machine can be easily reconfigured for different process gases, process recipes or for the integration of new etch processes. Overall, LAM RESEARCH Kiyo45 Poly is a highly accurate and reliable etching and ashing tool for the semiconductor industry, providing excellent repeatability and profile control. With its high-speed etch feature and atmosphere-pressure capabilities, this asset is suitable for a variety of applications, including high-precision etching, via etching, STI etching, contact hole etching, passivation layer etching and waveguide etching.