Used LAM RESEARCH / ONTRAK 2300 Exelan Flex #9205200 for sale
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ID: 9205200
Wafer Size: 12"
Vintage: 2005
Dielectric etcher, 12"
Process: Oxide etcher
Cassette type: (25) Slots Cassette
PM1: LAM 2300 Exelan flex
PM2: LAM 2300 Exelan flex
PM3: LAM 2300 Exelan flex
Gas system type: IGS Gas box
Options:
ESC Type: 385
ESC Cooling: Dual zone
Upper electrode: Heated
Bias match:
2 MHz (5000 W)
27 MHz (3000 W)
12” Turbo pump: 1600 L/s EDWARDS
Endpoint detection: OES
ATM Configurations:
Front end loadport cassette: 3 FOUP
Cassette ID: Hermos carrierid
Factory automation: OHTPIO Sensor w / Light curtain
Input buffer station: (25) Slots
VTM Configurations:
Conditioning station A: No
Conditioning station B: No
Airlock wafer fingers: Stainless wafer pads
Backing pumps for TM: EDWARDS EPX180
Peripherals:
TCU Config: ATS DEX-20A (HT200)
Scrubber
Gas box:
MFC Type: Unit 8561
(12) Gas lines
Tuning gas1 type: O2
Tuning gas1 flow: 10 sccm
Gas box configuration:
Line MFC Type Gas type Gas flow
Line1 Unit 8561 Ar 1000
Line2 Unit 8561 O2 3000
Line3 Unit 8561 CH2F2 100
Line4 Unit 8561 N2 500
Line5 Unit 8561 CO 500
Line6 Unit 8561 CF4 200
Line7 Unit 8561 C4F8 50
Line8 Unit 8561 C4F6 50
Line9 Unit 8561 SF6 100
Line10 Unit 8561 O2 50
Line11 Unit 8561 CHF3 100
Missing parts:
(3) Flex 45 chambers
LAM 2300 ATM Robot o-ring
Ring
He
ESC 38x
RND, 300 M
2005 vintage.
LAM RESEARCH / ONTRAK 2300 Exelan Flex is a state-of-the-art etcher / asher equipment that provides superior performance for a variety engineering processes. The system includes a fully integrated suite of modules, components, and tools that enable most modern-day etching, plasma cleaning and surface modification techniques. This flexibility and automation allows regularly scheduled, repeatable processes toun like photolithography, etching, plasma cleaning, and surface modification become faster and more efficient. The high precision unit is equipped with a programmable Active End-Point (AEP) controller, allowing a variety of etch profiles and regulating the etch and clean processes. As the etch process progresses the AEP automatically adjusts the etch time and current, which ensures a consistent etch rate throughout the process. This allows for higher quality, repeatability and productivity of engineering projects. The AEP is able to manage devices with various sizes, heights and shapes and can measure the progress of the etch through the material's profile. This machine is fully customizable for optimized for different processes to meet user requirements. It includes an onboard overpressure variable reactive forward (OVRF) pressure control tool that is capable of achieving ultra-low vacuum conditions down to 0.0001 Torr. This low pressure capability allows for enhanced etching accuracy and better adhesion of photoresist materials to the substrate. It also offers surface finish control and advanced materials etching management. It has a high-performance valve control asset that allows for process interruption in under one second for reduced risk of contamination. Using EPA (Etching Process Automation) firmware, the model features various automated features to simplify setup and cell optimization. This includes a process logbook, set-up wizards, trend analysis, performance monitoring, improved cycle time optimization and single recipe processing. This helps ensure consistency, repeatability and accuracy. The equipment can be easily monitored and controlled with a fully integrated in-site and remote control system. It offers fast response times over the network and is compatible with popular software to easily monitor and control various settings. The remote access allows for faster problem solving, multi-remote analysis, faster maintenance cycles and traceability audits. ONTRAK 2300 Exelan Flex is an advanced etching unit that offers precision, flexibility, and automation for a variety of engineering processes. With its automated features and high performance components, this state-of-the-art machine provides tools for fast, accurate and efficient etching, plasma cleaning and surface modification.
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