Used LAM RESEARCH / ONTRAK 2300 Exelan Flex #9205200 for sale

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ID: 9205200
Wafer Size: 12"
Vintage: 2005
Dielectric etcher, 12" Process: Oxide etcher Cassette type: (25) Slots Cassette PM1: LAM 2300 Exelan flex PM2: LAM 2300 Exelan flex PM3: LAM 2300 Exelan flex Gas system type: IGS Gas box Options: ESC Type: 385 ESC Cooling: Dual zone Upper electrode: Heated Bias match: 2 MHz (5000 W) 27 MHz (3000 W) 12” Turbo pump: 1600 L/s EDWARDS Endpoint detection: OES ATM Configurations: Front end loadport cassette: 3 FOUP Cassette ID: Hermos carrierid Factory automation: OHTPIO Sensor w / Light curtain Input buffer station: (25) Slots VTM Configurations: Conditioning station A: No Conditioning station B: No Airlock wafer fingers: Stainless wafer pads Backing pumps for TM: EDWARDS EPX180 Peripherals: TCU Config: ATS DEX-20A (HT200) Scrubber Gas box: MFC Type: Unit 8561 (12) Gas lines Tuning gas1 type: O2 Tuning gas1 flow: 10 sccm Gas box configuration: Line MFC Type Gas type Gas flow Line1 Unit 8561 Ar 1000 Line2 Unit 8561 O2 3000 Line3 Unit 8561 CH2F2 100 Line4 Unit 8561 N2 500 Line5 Unit 8561 CO 500 Line6 Unit 8561 CF4 200 Line7 Unit 8561 C4F8 50 Line8 Unit 8561 C4F6 50 Line9 Unit 8561 SF6 100 Line10 Unit 8561 O2 50 Line11 Unit 8561 CHF3 100 Missing parts: (3) Flex 45 chambers LAM 2300 ATM Robot o-ring Ring He ESC 38x RND, 300 M 2005 vintage.
LAM RESEARCH / ONTRAK 2300 Exelan Flex is a state-of-the-art etcher / asher equipment that provides superior performance for a variety engineering processes. The system includes a fully integrated suite of modules, components, and tools that enable most modern-day etching, plasma cleaning and surface modification techniques. This flexibility and automation allows regularly scheduled, repeatable processes toun like photolithography, etching, plasma cleaning, and surface modification become faster and more efficient. The high precision unit is equipped with a programmable Active End-Point (AEP) controller, allowing a variety of etch profiles and regulating the etch and clean processes. As the etch process progresses the AEP automatically adjusts the etch time and current, which ensures a consistent etch rate throughout the process. This allows for higher quality, repeatability and productivity of engineering projects. The AEP is able to manage devices with various sizes, heights and shapes and can measure the progress of the etch through the material's profile. This machine is fully customizable for optimized for different processes to meet user requirements. It includes an onboard overpressure variable reactive forward (OVRF) pressure control tool that is capable of achieving ultra-low vacuum conditions down to 0.0001 Torr. This low pressure capability allows for enhanced etching accuracy and better adhesion of photoresist materials to the substrate. It also offers surface finish control and advanced materials etching management. It has a high-performance valve control asset that allows for process interruption in under one second for reduced risk of contamination. Using EPA (Etching Process Automation) firmware, the model features various automated features to simplify setup and cell optimization. This includes a process logbook, set-up wizards, trend analysis, performance monitoring, improved cycle time optimization and single recipe processing. This helps ensure consistency, repeatability and accuracy. The equipment can be easily monitored and controlled with a fully integrated in-site and remote control system. It offers fast response times over the network and is compatible with popular software to easily monitor and control various settings. The remote access allows for faster problem solving, multi-remote analysis, faster maintenance cycles and traceability audits. ONTRAK 2300 Exelan Flex is an advanced etching unit that offers precision, flexibility, and automation for a variety of engineering processes. With its automated features and high performance components, this state-of-the-art machine provides tools for fast, accurate and efficient etching, plasma cleaning and surface modification.
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