Used LAM RESEARCH / ONTRAK 2300 Exelan Flex #9232235 for sale

LAM RESEARCH / ONTRAK 2300 Exelan Flex is an etcher/asher designed to produce high-precision devices and patterns on wafers. It is a advanced etcher/asher that uses ProExel technology to accurately etch and ashe silicon and other materials using a combination of physical vapor deposition (PVD) and chemical vapor deposition (CVD) on wafers of varying sizes and thicknesses. The etcher/asher is made up of several components, including a frequency-modulated plasma source, a horizontal lift-off chamber, a wet plasma reactor, a vertical lift-off chamber, an etch chamber, and a load lock. The plasma source produces high-energy ions that interact with the material being etched to improve etch selectivity and reduce etch rates. The horizontal lift-off chamber allows operators to tilt and rotate the wafers, allowing them to move freely throughout the process. The wet plasma reactor produces uniform etch profiles without the need for wafer protection films or a separate chamber. The vertical lift-off chamber and etch chamber further enhance the automation of the etch process, allowing operators to keep a closer eye on etch rate and selectivity for complex architectures. Finally, the load lock ensures that wafers remain securely locked in place throughout the entire processing cycle. ONTRAK 2300 Exelan Flex etcher/asher offers several benefits that make it a popular choice for a variety of device-level process applications. It can operate at temperatures up to 800°C and is capable of producing critical geometries with repeatable accuracy. The etcher/asher can be used to create a variety of metals and alloys with excellent etch profiles that make them ideal for MEMS, IO, microfluidics, and III-V applications. The etcher/asher also offers flexibility with coatings, including the ability to deposit a wide range of metals, dielectric layers, and dielectric stacks. Finally, the Exelan Flex etcher/asher is one of the most efficient etchers/ashers on the market, allowing high-volume processes without sacrificing quality.