Used LAM RESEARCH / ONTRAK 2300 Exelan Flex #9240729 for sale

LAM RESEARCH / ONTRAK 2300 Exelan Flex
ID: 9240729
Wafer Size: 12"
Vintage: 2001
Dielectric etcher, 12" 2001 vintage.
LAM RESEARCH / ONTRAK 2300 Exelan Flex is a high-precision plasma etching equipment featuring a patented plasma technology. This etcher is designed for a wide range of semiconductor applications, featuring superior etch quality, high process stability, and excellent uniformity. It offers a large temperature range and supports a wide range of operating conditions. The etcher can also be used in clustering applications and can accommodate up to eight process chambers, allowing for simultaneous etching of components. The Exelan Flex is powered by a pulsed plasma source, enabling superior etch process control for applications such as via etch, gate oxide etch, nitride etch, and high aspect ratio etch. Its advanced plasma processing system utilizes a multi-dimensional magnetic field to generate a uniform plasma distribution and a highly repeatable etch profile. This results in superior etch depth uniformity and low device standing waves. It also has an integrated gas mixer and an automated gas panel for dynamic process control. The etcher is equipped with an onboard optical end-point detection unit for monitoring the etch process. It also has an automated control machine that monitors and adjusts etch parameters to enable accurate and repeatable etch profiles. The Exelan Flex has a small footprint and can be easily integrated with other equipment, such as a wafer loader, robot handler, or post-etch inspection tool. It features a modular design that allows for full customization of asset configurations, while also providing easy maintenance and process transfer. In conclusion, ONTRAK 2300 Exelan Flex is a highly innovative etcher designed for a wide range of semiconductor applications, with superior etch quality, high process stability, and excellent uniformity. Its advanced plasma processing technology and highly repeatable etch profile makes it an ideal choice for plasma etching processes.
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