Used LAM RESEARCH / ONTRAK TCP 9400 SE #196518 for sale
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ID: 196518
Wafer Size: 8"
Vintage: 1997
ICP Poly etcher, 8"
Specifications:
Electrostatic Chuck
Envision Software
Heater jackets for turbo pump and Vat Valve
8 MFC Gas Box
Includes dry pumps for load lock and process chamber
Currently de-installed and in storage
1997 vintage.
LAM RESEARCH / ONTRAK TCP 9400 SE is a compact, high-performance, dry-in-place etching solution for substrate etching applications. The equipment is capable of processing substrates with a thickness of up to 4mm, and its sophisticated software control system provides high precision control of process parameters and repeatability. Combining fast cycle times and sophisticated process control, ONTRAK TCP 9400 SE is an ideal choice for substrate etching and processing. The unit is equipped with a gas delivery machine capable of delivering both oxygen and chlorine from two separate reservoirs. The gas delivery tool is designed to provide a consistent flow of gas to the substrate during the etching process. Additionally, the asset has been designed to be easily upgradable to provide higher performance. LAM RESEARCH TCP 9400 SE features two independently adjustable, temperature-controlled process chucks, allowing for etching of different substrates in parallel for increased throughput. A hot plate is also available for uniform heating of substrates, and a full-function remote access keypad allows for easy operation of the model. Additionally, the equipment includes an integrated cooling package to provide precise temperature control during process cycle times. The system comes with a range of integrated accessories and tools, including an etching probe, tweezers, and lapping tool for precision processes. Data output from the unit is provided in both visual and programmable formats, allowing for easy analysis and control of process variables. Additionally, the machine provides fast cycle time capability due to its high-speed, closed-loop control. TCP 9400 SE is a reliable and versatile etch solution for a range of substrate etching applications. With its high performance and precision control, it can increase efficiency and throughput for the user. Furthermore, its advanced software and integrated accessories allow for easy access and control of the etching process.
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