Used LAM RESEARCH / ONTRAK TCP 9400 SE #9134003 for sale
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ID: 9134003
Wafer Size: 4"-12"
Etcher, 4"-12"
Oxide
Flat wafers
ESC chuck
(1) Chamber
GAS NO GAS NAME MAKER MODEL FULL SCALE
1 02 TYLAN FC-2950MEP5 200SCCM
2 02 TYLAN FC-2950MEP5 10SCCM
3 N2 TYLAN FC-2950MEP5 10SCCM
4 SF6 TYLAN FC-2950MEP5 50SCCM
5 HBR TYLAN FC-2950MEP5 200SCCM
6 CF4 AERA FC-D980C 500SCCM
7 CL2 AERA FC-D980C 200SCCM
8 70%HE+30%O2 AERA FC-D980C 20SCCM
9 HE UNITY 8100Seris 50SCCM
BOARD BOX:
CPU
ADIO#5
ADIO#7
ADIO#8
ADIO#9
ADIO#11
ADIO#13
SERIAL
PRESSURE:
LOCATION MAKE MODEL
CHAMBER CM MKS
TURNEL MKS 625A11TDE
FORLINE MKS 625A11TDE
BACK HE TYLAN CMLA-21
RF GENERATOR MACHER
TOP AE RFDS 1250 R-KIT
BOTTOM AE RFG 1250 MINI
PUMP:
SEIKO SEIKI H2002C
SEIKO SEIKI STP-H200C
PRESSURE CONTROL:
VAT 65048-PH52-ABU2
VAT PM-7
FUNCTION CHECK:
INDEX MOVING
SHUTTLE MOVING
ARM MOVING
PRESSER CONTROL
GAS FLOW TEST
GAP MOVING
RF ON/OFF
ESC ON/OFF
AUTO RUNING TEST.
LAM RESEARCH / ONTRAK TCP 9400 SE is a semi-automatic etcher and asher. It is a single-wafer equipment designed for a wide range of etching, ashing, and deposition processes. It features two gas chambers, each with independent flow and temperature control. It also features an automatic substrate centering system for precise wafer positioning and the capability to perform both wet and dry processes in a single run. The unit is equipped with a high-performance PC based control machine and easy-to-use Windows™ style software interfaces. The programmable process recipes provide process set-up capabilities, data storage for up to 20 user-defined processes, as well as flexible process control with a large selection of parameters. The tool also includes a monitor strip chart that allows the user to quickly view process data and identify problems. ONTRAK TCP 9400 SE can handle a wide range of substrates including silicon wafers, photolithography masks, quartz and ceramic. The wafer chambers can accommodate up to 400mm, 200mm, and 150mm round substrates. The asset also offers a wide variety of etching and ashing reactions for aluminum, polysilicon, titanium, silicon, and other materials. The model includes an integrated safety interlock equipment for maximum protection. It also includes an Endpoint Detection Subsystem (EDS) which helps the operator monitor substrate damage, as well as a Fast Cooling Subsystem (FCS) which aids in preventing thermal damage during the etching process. The system offers excellent performance for a wide range of etching and ashing applications. Its high-performance controller and software make automated processing quick and easy. The unit also offers outstanding safety features and protection for both the operator and the substrates. All these features make LAM RESEARCH TCP 9400 SE an excellent choice for process engineers.
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