Used LAM RESEARCH / ONTRAK TCP 9400 SE #9203958 for sale
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ID: 9203958
Wafer Size: 8"
Etcher, 8"
With cassette to cassette transport
Model 9408 includes
Rainbow platform
Ceramic free chamber with waferless auto clean (WAC)
Single chamber stand-alone version
LEYBOLD HERAEUS TURBOVAC 1000C Turbo-molecular vacuum pump
Inductively coupled source (TCP)
ESC 9400
Environmental requirements:
Temperature: 22 ± 2°C
Humidity: <50 %
Vibration sensitivity: Slight
Thermal output (BTU/Hr):
Carrier by water: 9400
Carrier by exhaust: 8400
Dispersed to environment: 20,000
Total output: 38,000
RF Generator:
Carrier by exhaust: 5000
Dispersed to environment: 3000
Total output: 8000
Power requirements: 208 VAC, 50/60Hz, 3 Phase, 80/63Amps
(5) Conductors
Type: Wye
Receptacle required: Hardwired
CE Marked.
LAM RESEARCH / ONTRAK TCP 9400 SE is a fully automated, single-sided etcher / asher for semiconductor wafer processing. The unit is designed to provide excellent processing control, high production yields, and a wide range of etching and ashing applications. This etcher / asher consists of a main chamber and a heated, pressure controlled plasma source as well as independent substrate bias, temperature and pressure control. The etcher / asher is also equipped with a precision particle optical microscope that is used to monitor the surface of the substrate during processing. The chamber capacity is 200 mm (8") wafer pieces or 90 mm (3.5") full wafers. ONTRAK TCP 9400 SE features a highly versatile, multi-functional process module that provides excellent flexibility, reliability, repeatability and accuracy. The sophisticated control system allows precise etching and ashing of both unreactive metals and reactive semiconductor materials in a single tool. The unit is capable of etching and ashing a wide range of surfaces, from extremely thin semiconductor devices to thick structures. In addition, the unit is designed for both high vacuum plasma etching / ashing and low pressure plasma etching / ashing. The etcher / asher is designed with precise process control and excellent stability, so that the process can be fully optimized. The precise manipulator allows precise scanning of the wafer during etching or ashing, and for precise monitoring of actual etch rates. The etcher / asher is also capable of repeatably precise trench formation in semiconductor substrates. LAM RESEARCH TCP 9400 SE offers excellent protection against wafer damage due to its high-speed multiple process and in-situ cleaning capability. The precise manipulator also ensures uniform processing of critical structures and accurate thermal contact across the chamber. Additionally, the high efficiency of the integrated laser diffraction diagnostics allows precise process control and analysis, while eliminating dust particle contamination. Overall, TCP 9400 SE is a high-performance etcher / asher that provides precise and reliable etching and ashing for a wide range of semiconductor wafer structures. The unit is designed for precise control of etching and ashing processes, as well as repeatable performance and excellent yield. Additionally, it is also designed for high vacuum and low pressure plasma processing, making it an ideal solution for semiconductor applications.
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