Used LAM RESEARCH Rainbow 4420 #9151548 for sale
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ID: 9151548
Poly etcher, 8"
Main body
RF Unit
Power box
Clamp
OEM-6A RF Generator
CMH-11SO2 Process manometer
CMH-11SO2 Reference manometer
CMLA-21 He Pressure manometer
UPC-1360 He UPC
839-013522-001 Pressure control valve
AC-2 Controller
MFC:
Channel / Gases / Scale / Connection size
1 / HE / 300 / 1/4" VAC Male
2 / AR / 300 / 1/4" VAC Male
3 / O2 / 2500 / 1/4" VAC Male
4 / C2F6 / 350 / 1/4" VAC Male
5 / SF6 / 250 / 1/4" VAC Male
6 / HBR / 200 / 1/4" VAC Male
7 / CL2 / 300 / 1/4" VAC Male
8 / NF3 / 500 / 1/4" VAC Male
PCW:
Qty / Unit / Connection size
(4) / Main body / 3/8" SWG Male
(2) / RF Unit / 3/8" SWG Male
Vacuum:
Qty / Unit / Connection size
(1) / Main body (Chamber) / ISO 80
(1) / Main body (L/L) / NW-60
CDA:
Qty / Unit / Connection size
(1) / Main body / QC6 Connector
Power supply:
Power box: Φ3, 208 V, 5-Wire, 100 A, 50/60 Hz
Main body: Φ3, 208 V, 5-Wire, 100 A, 50/60 Hz
RF Unit: Φ3, 208 V, 5-Wire, 100 A, 50/60 Hz.
LAM RESEARCH Rainbow 4420 is a state-of-the-art etcher/asher equipment designed to deliver precision performance in semiconductor device fabrication. The high-performance horizontal based system offers fast and accurate etch rates, and provides the perfect platform for the most demanding etching and ashing applications. Rainbow 4420 can process a range of wafer sizes, from 200mm to 8-inch wafers, making it suitable for all types of wafer processes. It is built using a closed-cycle ultra-high vacuum (UHV) process sputter chamber, offering a highly reliable and repeatable etch/ash cycle. LAM RESEARCH Rainbow 4420 can handle up to three gas inputs simultaneously; offering a choice of etch or ash process for maximum flexibility. Rainbow 4420 boasts a highly reliable radio frequency (RF) driven process. This ensures fast and accurate etch rates, for improved performance. The unit is equipped with state-of-the-art end point detection capability, enabling control of the etching process from start to finish. LAM RESEARCH Rainbow 4420 offers a wide range of etch and ash process gases, such as Oxygen, Carbon Tetrafluoride, and Argon. LAM RESEARCH advanced process control options, such as Profile and Pressure Control options, provide excellent process repeatability. The Profile Control feature is a recipe-based process which permits control of deposition thickness, while the Pressure Control option utilizes the RF energy to regulate the particles' energy, ensures excellent uniformity between wafers. Rainbow 4420 is designed with safety in mind, including a user friendly touch screen LCD interface and safety features like safety interlocks and automatic gas shut-offs. It also includes an error log machine for automated process logging, ensuring maximum process control and elimination of potential process defects. LAM RESEARCH Rainbow 4420 is the perfect tool for sophisticated semiconductor etching/ashing needs. With fast, accurate and repeatable results, the asset is ideal for ensuring consistent product yields and highest quality possible.
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