Used LAM RESEARCH Rainbow 4520 #9221215 for sale
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ID: 9221215
Wafer Size: 8"
Oxide etcher, 8"
Includes:
PDW-2200 RF Generator
CMH-11S02 Process manometer
Reference manometer
CMLA-21 Heat pressure manometer
UPC-1300 He UPC
839-013901-001 Pressure control valve
AC-2S06 AC2 Controller
MFC:
Channel / Gas / Scale
1 / AR / 1000
2 / CF4 / 400
3 / CFHF3 / 100
4 / HE / 1000
5 / O2 / 20
6 / N2 / 100.
LAM RESEARCH Rainbow 4520 is an ideal advanced etcher and asher equipment for applications in the semiconductor industry. It offers the capability to etch and asher layers of silicon, metals, and organic materials in wafers of up to 300mm in size. Rainbow 4520 utilizes a sophisticated Linear Inductively Coupled Plasma (LICP) source to create highly repeatable, homogenous process results. The LICP source may be tuned to produce the desired plasma parameters for the etching or ashing process, ranging from 0-500 W for etching and 0-200 W for ashing. Advanced wafer handling and transport technology is used to ensure accurate wafer loading, and the system is equipped with an Automatic Plasma Slab Expansion Control (APS) mechanism that prevents plasma loading issues commonly associated with chamber cleaning operations. The chamber of LAM RESEARCH Rainbow 4520 has a maximum process volume of 360 liters, and is enclosed with an RF generator to lessen rogue species deposition on the chamber walls, further aiding in its reliability. In addition, several chamber pre-cleaning and clean-in-place options are available to ensure the highest levels of repeatability in process results. The machine also utilizes a range of pressure and flow controllers to maintain a precisely controlled environment within the chamber. Vacuum levels may be set to a minimum of 1 mTorr, ensuring the lowest base pressure possible for wafer process. Rainbow 4520 is capable of accurately using a range of process gases, such as argon, SF6, oxygen, N2, O2, and NF3, as defined by the process recipe. LAM RESEARCH Rainbow 4520 also features digital and analogue display devices as well as software for the development of advanced recipes, enabling the user to achieve repeatable, high-quality etching and ashing results. The unit is also capable of process monitoring and logging during a recipe cycle and provides advanced features, such as overpressure protection, process window mapping, and dual platen design for improved cleanser repeatability, further guaranteeing high process yields. The machine has been designed and tested for ultra-long-term repeatability and accuracy and can be controlled via a remote console, eliminating the need for users to be in close proximity. Rainbow 4520 is the ideal solution for advanced semiconductor device production.
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