Used LAM RESEARCH Rainbow 4XXX series #9176782 for sale

LAM RESEARCH Rainbow 4XXX series
ID: 9176782
Pump and frame Currently crated.
LAM RESEARCH Rainbow 4XXX series is a type of plasma etcher/asher equipment. This system is designed to etch a wide range of materials including semiconductors, metals, insulators and other tough materials. Rainbow 4XXX series utilizes a variety of techniques to achieve the desired etching profile which includes plasma etching, ion milling, reactive ion etching and reactive ion milling. It offers a high degree of control over etching parameters, including energy level, scanning speed, pattern repetition rate, and selectivity. The major components of this unit are the target surface, input power supply, RF power supply, plasma source and exhaust chamber. The target surface is the surface to be etched and is usually a semiconductor or metal surface. The input power supply controls the flow of electric current to the RF power supply. The RF power supply generates the RF field necessary to create the plasma. The plasma source is the source of the energized particles used to etch the target surface. Finally, the exhaust chamber is used to safely discharge the particles from the etching machine. The plasma etching process is based on an ionized bombardment of the target surface using energized particles. The RF power supply generates an electric field over the target surface. This electric field accelerates the particles to high velocities and the particles strike the target surface breaking the bonds between atoms and molecules. This process is used to remove a single-layer or several multilayer layers of material from the target surface. LAM RESEARCH Rainbow 4XXX series offers a variety of etching techniques including Deep Reactive Ion Etching, High Density Plasma Etching, and Ion Milling. Deep Reactive Ion Etching (DRIE) is used to etch through multiple layers of materials while optimizing selectivity. This technique involves a series of etching cycles where the ions strike the target surface with increasing energy levels. High Density Plasma Etching (HDPC) is a form of plasma etching used to etch very thin layers of material. Ion milling is a low energy etching technique used to create precise features. Rainbow 4XXX series offers many advantages including high etching rates, low consumption of etching chemistry, a low operating cost, and less downtime than other etching systems. Additionally, its compact size and ease of use make it ideal for the semiconductor industry. LAM RESEARCH Rainbow 4XXX series provides users with a reliable tool for accurately etching a variety of materials, making it an ideal choice for a variety of fabrication processes.
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