Used LAM RESEARCH Rainbow #9118482 for sale

LAM RESEARCH Rainbow
ID: 9118482
Lot of Spare Parts: (1) 4420 Main Body (currently crated) (1) 4420, Main Body (2) Lam Rainbow 4400B (1) Lam Rainbow 4400 (1) 4400B, Main Body, Parts Machine (3) 4528B, Main Body (1) 4520, Main Body (1) 4600BW, Main Body (1) 4728B, Main Body (2) Chiller (currently crated) (7) Chillers (1) Pump (currently crated) (1) Pump Frame (no pump) (2) RF Generators (currently crated) (8) RF Generators (8) RF Generator Carts (2) Portable Monitors.
LAM RESEARCH Rainbow is an etch/ash equipment designed for the process of etching/ashing in semiconductor manufacturing. It is capable of operating in a variety of chemistries, such as dry and wet etch, and combinations thereof, with a comprehensive suite of process recipes designed specifically for etching/ashing very thin layers of features. Its features include low-temperature processing in order to ensure low thermal-induced stresses, uniformity in removal rate and mask shape accuracy, as well as advanced safety features. The system can accurately etch/ash layers of Silicon (Si), Silicon Carbide (SiC), Germanium (Ge), and other semiconductor materials used in the fabrication of MEMS, NEMS, and VLSI devices. The unit is composed of various components for precision etching/ashing including a process chamber, high-vacuum pumping systems, a coolant machine, a process control tool, and an optional plasma source for vapor phase etching. The process chamber is a hermetically sealed enclosure with a substrate holder allowing the sample to be exposed to a controlled environment. Depending on the process requirements and chamber size, it can contain a variety of electrodes for spraying ions onto the wafer. High-vacuum pumps are designed to maintain a low pressure environment within the process chamber. The coolant asset is used to lower the temperature of the process chamber during etching/ashing, ensuring that any heat generated is dissipated. The process control model allows for automated control of the etching/ashing process parameters, as well as data logging of all process information. Rainbow etch/ash equipment can be used to remove layers of Silicon, Silicon Carbide, Germanium, and other semiconductor materials with extremely low thermal-induced stresses due to the low-temperature processing capabilities. The system features highly precise etching/ashing capabilities, allowing for uniform removal rate of layers with high mask shape accuracy. With its comprehensive suite of recipes, operators can easily customize the process for their specific application requirements. Additionally, the reactor offers a high degree of safety, with safety interlocks to prevent any hazardous operations from occurring. The unit is suitable for both laboratory and production environments.
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