Used LAM RESEARCH TCP 9400 #9364645 for sale

LAM RESEARCH TCP 9400 asher / etcher is a reactive ion etching (RIE) equipment designed for the dry etching of challenging materials using various chemistries such as CF4, NF3,SF6 and O2. This system has the ability to etch features on to a substrate in a highly reproducible and repeatable manner. It can etch with traceable feature size accuracy and uniformity in both planar and 3-dimensional form. It is equipped with the latest two chamber technology - LaB6 and the new WFMS chamber. The LaB6, which stands for "Low Pressure Acoustic Barrier Etching", is exceptionally well-suited for barium fluoride, silicon and doped silicon etching. The new WFMS chamber has recently been added, which stands for "Wide Area Field Mass Spectrometry" and is ideal for device and patterned wafer level processing. TCP 9400 etcher / asher utilizes advanced media delivery systems, allowing for the precise delivery of gases and chemistries. It also features Gas Flow Control Unit (GFCS) with "total" and "partial" gas nebula control. Additionally, remote monitoring capability is provided in both chambers, allowing for process control and process data feedback. LAM RESEARCH TCP 9400 asher / etcher also features highly advanced wafer transport capabilities. Wafers can be transported into and out of both chambers using the semi-automatic wafer loading/unloading machine. This convenient tool allows for safe, automated, and metrology inspected wafer handling. TCP 9400 asher / etcher is designed with a self-functioning computer drive. This feature guarantees trouble-free operation and eliminates the need for any kind of programming. The asset provides fast wafer retrieval and unloading times and is designed for a wide scope of batch and single wafer processes. It also utilizes a novel plasma generator, low thermal loading, auto-detect wafer orientation, and side wall etch capabilities. LAM RESEARCH TCP 9400 etcher / asher is an invaluable resource for controlling and executing rapid etching processes. Its extensive variety of advanced features makes it ideal for producing high quality, highly reliable parts and components. It is ideal for the rapid, precise etching of a wide range of materials including pure Silicon wafers, resin-coated wafers, silicon-on-insulator (SOI) wafers, metal-oxide-semiconductor wafer (MOS) wafers and a variety of other deposition materials.