Used LAM RESEARCH TCP 9600 SE #9177741 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

ID: 9177741
Wafer Size: 8"
Vintage: 2000
Metal etcher system, 8" Software version: Version E1.5-released Software envision: 1.5 With light pen Process METAL ETCH Platform type: Rainbow stand-alone TCP 9600SE Wafer shape: SNNF Main chamber: TCP 9600SE Enterance loadlock: Standard entrance loadlock chamber Exit loadlock: DSQ Chamber with 8″ paddle APM Chamber: (2) APM DI Nozzles, N2 splayer Load station: Belt type shuttle Indexers: 38A Hine indexers Wafer alinger: Universal Upper chamber body: TCP 9600se Gap: 6CM Upper chamber fixed gap Electrostatic chuck type: 8″ Bi-polar ESC Turbo pump: ALCATEL 1300M with Controller Pressure manometer: Millipore 100mT Pressure controller: VAT Gate valve PM7 Pressure controller End point: Detector heated port With dual channels (261.8nm/ 703nm) Matchers: Auto tuner T Matcher for upper (8) Turn RF coil matcher for Bias Generators on board: AE-1250 For upper and bias chamber Helium back side cooling 50sccm UPC (Unit 8130) ADIO Boards Main board ESC Power supply: (16) Channel heater controllers Chamber: Auto tune DSQ strip module Funnel: 8″ Quartz funnel Paddle: 8″ Heated Paddle Hardware configuration: Pressure controller: AC2 Pressure controller Pressure manometer: MKS 10TORR WVDS: Auto fill WVDS controller WVDS Temperature controller: Auto temp controller Cooling fan hinged DSQ stripper With high flow cooling fan Vapor controller: TYLAN 500sccm H2O Controller RF Tuner: (8) Tunes RF Coil matcher (DIP-PCB RF Tuner) RF Generator on board: AE-1250 Heater controller: 853-015771-001 Spinner: 853-015759-102 DI Water nozzles: Hot Cold high water flow nozzles Line 1: Gas CL2 Line 2: Gas BCL3 Line 3: Gas Ar MFC Size: 200sccm (Unit 1660) Line 4: Gas CF4 Line 5: Gas N2 Line 6: Gas O2 Line 7: Gas CF4 Line 8: Gas H20 EMCP*01 Part list: (1) Transporter Exit loadlock: DSQ Chamber with 8″ Paddle (1) Transporter APM Chamber: (2) APM DI nozzles, N2 splayer (1) Transporter Wafer alinger universal (1) Main chamber Electrostatic chuck type: 8″ Bi-polar ESC (1) Main chamber Pressure manometer: Millipore 100mT (1) Main chamber End point detector: Heated port with dual channels (261.8nm/ 703nm) (1) Main chamber Matchers: Auto tuner/ T Matcher for upper, (8) Turn RF coil matcher for Bias (2) Main chamber Generators on board: AE-1250 For upper and bias chamber (1) Main chamber Helium back side: Cooling 50sccm UPC (Unit 8130) (8) Main chamber ADIO Boards (1) Main chamber Main board (1) Main chamber ESC Power supply (2) Main chamber (16) Channel heater controllers (1) PLL Chamber Paddle: 8″ Heated paddle (1) PLL Chamber WVDS Auto fill WVDS controller (1) PLL Chamber Vapor controller: TYLAN 500sccm H2O Controller (1) PLL Chamber RF Generator on board: AE-1250 (1) PLL Chamber Heater controller: 853-015771-001 (1) PLL Chamber Spinner 853-015759-102 Currently warehoused 2000 vintage.
LAM RESEARCH TCP 9600 SE is an etcher, or asher, designed for use in the semiconductor production process. This etcher is specifically designed for chemical, physical and abrasive etching processes. It is a fully automated wet-etch tool with a programmable process chamber, a liquid delivery equipment and a highly reliable, durable and robust mechanical system. It has a 250mm x 250mm processing chamber that can process both dielectric and metallic substrates. LAM RESEARCH TCP 9600SE is equipped with a unique jet shower delivery unit that provides superior etching selectivity and uniform etching results. It also has an integrated, sealed process chamber enabling fast and efficient wetting of wafers and coverslips. The process chamber is maintained at a controlled pressure, temperature and humidity in order to produce superior etching results. Additionally, TCP 9600 SE is designed with an advanced control machine which allows for precise control of etching parameters throughout the entire process. This tool can be programmed to collect data from over 20 different points of process parameters. This data can then be used to carefully monitor etching parameters, allowing for optimized etching results. Furthermore, TCP 9600SE also offers a variety of safety features. The integrated chamber pressure and temperature sensors, along with the chamber's dry exhaust asset, can help to ensure the safety of personnel and the integrity of the product. LAM RESEARCH TCP 9600 SE also features numerous safety interlocks, including process chamber guards and maximum flow rate-sensitive interlocks. LAM RESEARCH TCP 9600SE is compatible with the majority of etching chemistries, including KOH, TMAH, tetra-ethyl ammonium hydroxide (TEAOH), and hydrofluoric acid. It can also be used with a large variety of substrates such as Si, GaAs, and alumina. TCP 9600 SE is intended for use in the semiconductor production process and offers superior etching selectivity, uniformity, and safety. It is designed for a wide range of substrate materials and etching chemistries, allowing for optimized etching results.
There are no reviews yet