Used LAM RESEARCH TCP 9600 SE #9283047 for sale

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ID: 9283047
Aluminum metal etcher With endpoint detector TiW layers Linewidth: 0.35 µm Transformer coupled plasma Coil controller Platen power Gases: Cl2, BCl3, HBr, SF6, CF4, Ar, N2, O2, He Pressure: 0-100 mTorr Top electrode power: 0-1250 W Lower electrode power: 0.1200 W Temperature: 55°C Decoupled Source Quartz (DSQ) Rate: 400 nm/min Standard recipe 600/601 for Al etcher rate: 800 nm/min Standard recipe 640 for Al2O3 etcher rate: 100-120 nm/min Substrate size: 150 mm Diameter Materials: Al, Al2O3, TiO2, poly Si, Nb Non IC compatible materials.
LAM RESEARCH TCP 9600 SE is an Etcher / Asher designed to provide chemical-mechanical planarization (CMP) / etching services required in the production of semiconductor devices. LAM RESEARCH TCP 9600SE is designed with an advanced two-stage etasten process and is capable of processing individual wafers up to 200 mm in diameter. TCP 9600 SE provides the ability to process up to six wafers simultaneously and has a nominal process speed of up to 1500 wafers per hour. Its Etch process utilizes chemical-mechanical polishing technology, which enables it to provide consistently high-quality surfaces for advanced device applications such as MEMS, compound semiconductors and magnetic devices. The throughput and flexibility of TCP 9600SE make it an ideal solution for customers who require a cost-effective solution for etching wafers at high production volumes. The Etch process in LAM RESEARCH TCP 9600 SE comprises of a two-stage etch and rinse process. The first stage is the use of a slurry and/or water jet to remove material from the wafer surface. The second stage is a polishing process which enables precise control of the wafer topography. The individual etch processes used in this process are matched to the application requirements, providing optimized profiles and improved CMP yields. The process also provides the ability to perform selective etching, which allows wafers with complex geometries to be etched to precise tolerances. LAM RESEARCH TCP 9600SE is compatible with a variety of standard chemical compositions and chemistries, and is designed to comply with industry-standard safety protocols and cleanliness requirements. The machine is also equipped with an integrated Programmable Logic Controller (PLC) for computer-controlled operational programing and monitoring of functions. TCP 9600 SE is a versatile Etcher / Asher solution which can be tailored to various process requirements and can handle wafer sizes from 75 - 200mm sizes. The machine is designed to provide excellent wafer surface results while being compact and cost-effective. It is a suitable solution for advanced etching and CMP process steps in production foundry, fab and R&D applications.
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