Used LAM RESEARCH TCP 9600 SE #9410050 for sale

LAM RESEARCH TCP 9600 SE is a flexible and cost-effective etcher (or asher) equipment designed specifically to meet the demands of device-level process technology requirements. This system is suitable for a wide range of process parameters, including holes, trenches, nozzles, embedded trenches, high aspect ratios, and dielectrics. With its advanced control package, this unit provides superior control, speed, and accuracy while minimising contamination and removing the need for costly process-based recipes. LAM RESEARCH TCP 9600SE uses a DC plasma source that enables high levels of etch selectivity and uniformity, as well as a high etch rate. This etcher is capable of processing small geometries and features, including 2D and 3D features, such as holes and trenches, with excellent yields and reproducibility. Additionally, the integrated X-Y motion machine allows for precise profiling and adjustment of features. The high accuracy motion control tool can be adjusted to ensure the uniformity of feature shapes and sizes. The etcher also features advanced technological features, such as integrated wafer cleaning and scrubbing, advanced pressure and flow control, and independent thermal zone control. Its process precision and accuracy is further enhanced by its proprietary advanced ChamberView technology, which enables critical in situ process monitoring capabilities. Furthermore, the integrated advanced Process Tuning Mode (PTM) provides superior accuracy and process control. TCP 9600 SE is adaptable for a range of processes, including front-end of line (FEOL) and back-end of line (BEOL) processes. It can process complex structures with an etch window ranging from 0.3 μm to 150 μm, depending on the type of material and process requirements. Additionally, the etcher has a built-in Electrodeposition and Evaporation Processes to allow the deposition of metals and dielectric layers with the same process. In conclusion, TCP 9600SE etcher is a cost-effective and reliable asset that can satisfy the most demanding device-level process technology requirements. The model offers excellent etch selectivity, uniformity, and accuracy, as well as advanced technologies that provide superior process control and process monitoring capabilities.