Used MARCH CS 1701 #9124399 for sale
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ID: 9124399
Wafer Size: 8"
RIE system, 8"
Clam shell
Manual load
MFCs currently set up for CF4, Ar, CHF3, O3 with N2 purge
Advanced energy RFX-600 600 w Rf 13.56 Mhz power with auto-tuning
Power supply: 110 V, 50/60 Hz.
MARCH CS 1701 is an advanced etcher/asher designed for standard semiconductor fabrications. This equipment utilizes a powerful CO2 laser providing a focused beam width of 8-35 μm with the ability to etch into substrates as thin as 20 μm. This laser is coupled with a two-axis galvo-scanning system that is capable of scanning across a 300 mm x 300 mm area with a minimum resolution of 0.1 µm to accurately etch the desired pattern onto any substrate. MARCH CS-1701 etcher/asher also comes with a 12" X-Y-Z stage designed to smoothly position the substrate. A maximum fine-tune speed of the stage during etching is 120 mm/s. The stage is likewise equipped with a mechanical shutter located above the etch area to help shield out any particulates during the etch process. CS 1701 is extremely efficient. This unit is capable of achieving etching depths up to 100 µm at desirable light laser spot sizes and features DRG power control that results in consistent productivity and superior quality etching. Thanks to the highly reliable and easy-to-use controller this machine can quickly adjust to settings as per the customer's instructions regardless of the substrate material or laser beam power settings. This etcher/asher can also provide excellent pattern recognition with a superior accuracy. CS-1701 is a cost-effective choice for etching and ashing both simple and complex patterns into substrates at a rate of 40 W per second. It is also capable of working with various materials such as silicon, glass, and metals, making it an ideal option for applications in the semiconductor industry, such as lithographic production, MEMS and microfluidic devices.
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