Used MARCH PX-1000 #293775356 for sale

MARCH PX-1000 is a state-of-the-art plasma etcher/asher equipment designed for precise and uniform processing of semiconductor wafers and other substrates in advanced research and development, as well as high-volume manufacturing environments. This versatile tool offers a wide range of process capabilities, including etching, ashing, and surface treatment, making it an essential asset for semiconductor device fabrication and MEMS (Micro-Electro-Mechanical Systems) manufacturing. MARCH PX 1000 features a robust and reliable vacuum chamber made of high-grade stainless steel, ensuring excellent process control and stability during etching and ashing operations. The system is equipped with advanced gas delivery and control systems, allowing precise manipulation of process gases such as oxygen, argon, fluorine, and other reactive species to achieve desired etch rates and selectivity. The gas flow can be accurately regulated to create uniform plasma density and distribution across the substrate surface, resulting in consistent and repeatable processing results. One of the key highlights of PX-1000 is its advanced RF (Radio Frequency) plasma generation technology, which enhances process efficiency and flexibility. The unit utilizes a high-power RF generator to create a highly ionized plasma in the process chamber, enabling fast and efficient etching of various materials, including silicon, silicon dioxide, nitrides, and other dielectric layers. The RF plasma source also enables precise control over ion energy and flux, leading to superior etch profile control and sidewall smoothness, critical for advanced device patterning and nanoscale feature fabrication. PX 1000 offers a range of etching and ashing modes, including isotropic and anisotropic etching, descum/ashing, and surface modification, allowing users to tailor process recipes to meet specific application requirements. The machine supports both RIE (Reactive Ion Etching) and ICP (Inductively Coupled Plasma) etching modes, offering flexibility in recipe development and optimization for different material stacks and device structures. Additionally, the tool features a user-friendly interface and intuitive software control, enabling easy recipe setup, monitoring, and data logging for process optimization and traceability. In terms of substrate handling, MARCH PX-1000 is designed to accommodate a variety of wafer sizes, ranging from small pieces up to 300mm wafers, making it suitable for both R&D and high-volume production environments. The asset is equipped with a reliable wafer chuck and handling mechanism to ensure precise substrate positioning and alignment during processing. Moreover, the chamber design incorporates advanced gas distribution and exhaust systems to minimize particle generation and cross-contamination, maintaining high process cleanliness and yield. Overall, MARCH PX 1000 plasma etcher/asher model combines advanced process technology, reliable hardware design, and user-friendly operation to deliver superior performance in semiconductor device fabrication and material processing applications. With its versatile process capabilities, high process repeatability, and excellent process control, PX-1000 is an ideal solution for demanding applications in the semiconductor industry, MEMS manufacturing, and research institutions requiring precision plasma processing for next-generation device development.