Used MATRIX 105 #9201800 for sale
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ID: 9201800
Wafer Size: 6"
Plasma asher descum, 6"
Enhanced gate oxide integrity
Reduced threshold and capacitance voltage shifts
Reduced contact resistance / Oxidation
Photoresist stripping:
High dose implant
Post-polysilicon etch
Post-metal etch
Post-oxide etch
Controlled resist removal:
Post-develop descum (pre-etch)
Dry / Wet process capability
Uniformity capability (<5% 1σ)
GaAs, InP Wafer strip and descum
Thin film head resist cleaning
Opto electronic devices cleaning
MEMS
Single wafer multi-step processing:
Precisely controlled and repeatable stripping of each wafer
(3) Programmable steps with overstrip
Capable of long process times for exceptional control
High throughput:
35 WPH on 150mm substrate
Aluminum wafer chuck:
Fast
Precise
Uniform removal of resist
Low particles:
0.1 Particles (>0.3μm) added per cm²
Proven system performance:
700 System ones in use worldwide
95% Uptime
Proven reactor design:
Closed-loop temperature control
Stable range for strip:
150°C - 250ºC (+/-5°C)
For descum:
70°C - 150ºC.
MATRIX 105 is an Etcher/Asher designed for low-cost experimentation and precise production applications in low-to-medium volume production of Printed Circuit Boards. It is equipped with a double-track equipment and utilizes up to 12" wide palletized air-cooled or air-cooled vacuum fixtures. The double-track system provides a unique flexibility in controlling track-to-track variation for different processing conditions. An encoder mounted to the platform assembly ensures exact positioning of the platens for a consistently precise etch-to-placement. The platform is station-guided to facilitate full coverage of the tracks. 105 offers precise control and low-cost operation with a simple, intuitive design that allows for rapid setup and calibration. It is equipped with a low-profile, self-adjusting drive unit with direct drive-to-platen capability, allowing for a low-cost operations without regular maintenance. The stainless steel track processes up to 12" wide rolls or sheets, enabling large-area coating. The low-profile allows for a thin material thickness while maintaining an accurate and consistent etching process. MATRIX 105 incorporates a high precision optical open-architecture design, providing assurance of the same PCB size and accurate through-hole placement for each run. Its user-friendly controls, adjustability, and accessible maintenance make it ideal for sputtered thin film applications. Additionally, the machine has a maximum temperature limit of 550°C for temperature-sensitive substrates. The tool is designed to uniformly heat its components for temperature-critical applications. The air-cooled vacuum fixtures offer a precise, repeatable process with greater control over temperature and process consistency. With a built-in air buffer, the asset is capable of controlling temperatures down to room temperature. The fixtures guarantee uniform positioning and uninterrupted etching. The adjustable conformal collar increases the field coverage area for temperature uniformity. The vacuum fixtures feature two large platens for dual-track etching that allow for low-temperature, high-precision processes. The model is equipped with an integrated EDGE300 controller for full PC-based process control. The controller offers a menu-driven, Windows-compatible control platform with a graphical interface to manage all process parameters. This user-friendly interface allows for quick setup and allows the process parameters to be changed for different applications without any need for programming additional parameters. 105 is a powerful, cost-effective choice for etching and ashing applications in the electronics industry. With its advanced double-track equipment, vacuum fixtures and EDGE300 controller, the system delivers the precision, repeatability, and uniformity required for high-volume production.
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