Used MATRIX 205 #9201811 for sale
URL successfully copied!
Tap to zoom
ID: 9201811
Wafer Size: 6"
Plasma asher / descum dry clean system, 6"
Including ranging:
50mm up to 150mm
The system optimizes vital device parameters:
Enhanced gate oxide integrity
Reduced threshold and capacitance voltage shifts
Reduced contact resistance / Oxidation
Photoresist Stripping:
High dose implant
Post-polysilicon etch
Post-metal etch
Post-oxide etch
Controlled resist removal:
Post-develop descum (pre-etch)
Dry / wet process capability
Uniformity capability (<5% 1σ)
GaAs, InP wafer strip and descum
Thin film head resist cleaning
Opto-electronic devices cleaning
MEMS
Single wafer multi-Step Processing:
Precisely controlled & repeatable stripping of each wafer
(3) programmable steps + overstrip
Capable of long process times for exceptional control
High throughput:
35 WPH on 150mm substrate
Aluminum Wafer Chuck:
Fast
Precise
Uniform removal of resist
Low Particles:
0.1 particles (>0.3μm) added per cm2
Proven System Performance:
700 System ones in use worldwide
95% uptime
Proven Reactor Design:
Closed-loop temperature control
Stable range for strip:
150°C – 250ºC (+/-5°C)
For descum:
70°C – 150ºC .
MATRIX 205 is an etcher/asher that is commonly used in the microelectronics industry in order to create complex shapes, patterns and images onto the surface of a wafer. The device is equipped with a high-vacuum system, allowing it to accurately etch fine circuits and other geometries, and is capable of very high-resolution imaging. Through the use of the device, it is possible to etch shapes in various sizes, such as lines, arcs, polygons and circles, in addition to performing various other tasks such as via cleaning, planarization and post-etch cleaning. The device features a cryogenic pump to provide an ultra-high vacuum and an ion source to provide etch uniformity. The etching process is driven by an electrical field, usually generated in a cylindrical chamber. The shape and size of the etching pattern is determined by the type of gas used for the etching process, and the current and voltage used to feed the ion source. The device also includes a vacuum chiller, a holder and a view port, and is capable of producing a line width down to 0.5 microns. The etching and cleaning processes are very efficient and typically take approximately five minutes to complete. The accuracy of the etched patterns is less than 1 micron. In addition, 205 can perform multiple etching tasks at once, and is capable of performing three or more etching steps simultaneously. This means that the device can be used to produce complex circuits quickly, without having to manually change out etching processes. Furthermore, the device has a built-in monitor and diagnostic system which enables it to provide instant feedback and troubleshoot any process problems that might arise. MATRIX 205 is highly reliable, easy to use and comes at a reasonable price. It is an ideal tool for producing intricate patterns, circuits and images in the microelectronics industry.
There are no reviews yet