Used MATTSON Aspen II #293633237 for sale

Manufacturer
MATTSON
Model
Aspen II
ID: 293633237
Wafer Size: 8"
Dual ICP systems, 8" Cassette door cylinder, 18" ICP Dual chamber with cooling chamber (4) Quartz tubes (4) RF Coils (4) Channels gas lines per chamber with MFC (4) AO Boards (4) Matching boxes (2) Heater blocks (2) Slit doors (2) Gas boxes (2) DI/O Boards (2) Process chambers (2) RF Generators (Comet cito plus) 2-Lift pins Pressure controller: (2) ACX, (2) Throttle valves Robot Shuttle Arm Platform Cassette door O-Ring and ISO valve CPU Board AI Board Indexer boar SECS II Board PIB Motor control board Analog filter board Terminal panel Operator interface: Y (SMIF Type).
MATTSON Aspen II is a high-performance precision etching machine designed for reliable operation in production and research environments. Its advanced technology makes it an ideal choice for etch rate control, substrate uniformity, and fine line pattern etching applications. Equipped with a fast and powerful 10 kW RF power supply and a PZT transducer, Aspen II provides excellent repeatability, high resolution resolution features, and excellent selectivity. It is capable of etching a variety of materials such as silicon, sapphire, quartz and glass. MATTSON Aspen II is equipped with a digital 4-axis CNC controller to ensure accurate and repeatable processing with ease. The machine is equipped with a wide range of in-situ and ex-situ process control equipment. This includes digital pressure control, in-situ chlorine gas sensing, and full automatic immersion pre-clean and post-clean programs. This provides an outstanding level of etch accuracy and throughput resulting in higher yields and shorter cycle times. Aspen II also features an advanced plasma source and advanced RF matching system. This combination is designed to provide excellent repeatable plasmas with minimum inverse loss and sustain the best process conditions. The plasma-source utilizes the patented Multi-Dose System (MDS). It is capable of providing a homogeneous glow discharge, tunable to provide higher deposition rates and improved etch selectivity. MATTSON Aspen II also supports a wide range of etch chemistries, including fluorine-based etching, indirect wet etching, and ion milling. For improved etch results, its process control equipment allows for optimized recipe and etch parameters to be set for each wafer processed. It is also capable of cleaning and stripping with both chemical and physical methods, such as ultra-sonic agitation. Aspen II provides a comprehensive solution for etching and ashing applications. It delivers excellent repeatability, high-resolution feature etching, and optimized throughput. Its advanced process control and plasma source design ensure quality results with less maintenance and downtime.
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