Used MATTSON Aspen II #9185171 for sale

MATTSON Aspen II is a reactive ion etch and asher equipment specifically designed for use in semiconductor wafer fabrication processes. This system is capable of etching and ashing substrates with a wide variety of etch/ash process chemistries. It features high speed, high throughput etching and ashing, thanks to its precisely positioned electrodes, very high repeatability, and low contamination levels. Aspen II is designed to work with both acids and gases, and can handle all types of etch/ash process chemistries without major modifications. MATTSON Aspen II can be used for plasma etching, ashing, and asher etching of incoming substrates, as well as for deposition of thin films. This unit is self-contained and operates in a single-stage vacuum chamber, which is sealed and maintained at specific pressures. It includes an etch/ash gas delivery machine, a chamber for the reaction, a RF radiant power supply, and a controller for operation and monitoring of the process. The chamber is custom designed to provide uniform etching of substrates via an elaborate array of electrodes, providing very accurate control of the surface chemistry of the substrate. The advantages of using Aspen II include its fast cycle times, high throughput, very high repeatability, and low contamination levels. The tool is designed to operate in a low-pressure environment, where the etching process is optimized for best results. The built-in gas delivery asset is programmable to provide flexibility in working with different process chemistries and substrates. The RF radiant power supply further ensures that the etching process is accurate and controlled. The maintenance of the model is also easy and cost-effective. The chamber and gas delivery equipment can be disassembled for cleaning, and all parts are easily replaced if needed. The system is also configured for automated diagnostics and troubleshooting, which makes maintenance very quick and easy. In conclusion, MATTSON Aspen II is a very capable etch and asher unit, specifically designed for use in semiconductor wafer fabrication processes. It is highly accurate and efficient, and its components are easy to replace if necessary. It is also very cost-effective, both in terms of initial investment and in terms of maintenance and upkeep. Aspen II is a great solution for any industry requiring reliable, repeatable, and fast etching and ashing of substrates.