Used MAXIS 300LC #293643703 for sale

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Manufacturer
MAXIS
Model
300LC
ID: 293643703
ICP Etchers.
MAXIS 300LC is a fully automated etcher and asher equipment that is designed to provide high-end etching, ashing, and chemical mechanical polishing (CMP) processes. It is integrated in an enclosed and sealed system that provides a clean and controlled environment to ensure consistent results. The unit includes an autoloader as well as sub-assemblies such as a substrate pre-treatment unit, etching chamber, CMP chamber and a tailgate scanner. A user-friendly touchscreen interface allows easy input of etching parameters, which can be tailored to meet process requirements. The autoloader is capable of handling a variety of different substrates including compound semiconductors, metal alloys, and ceramics. The substrate pre-treatment unit of 300LC etcher / asher is an automated machine that uses ultrasonics to inject and remove process media from the substrate. This feature allows for precise and uniform etching on the substrate surface. The etching chamber is a multi-stage tool that provides for high etching capability along with an optional auto-stopper asset for precise etch depth control. The CMP chamber is designed to provide high etch rates and lowCMP power consumption. It is equipped with an automatic pitchmatcher that allows for precise control of the etching rate. MAXIS 300LC is designed to provide versatile CMP capability, with features such as variable pitch and variable frequency to optimize etching and CMP processes. An optional plasma asher is available as well. The plasma asher uses RF technology to produce a uniform etch and passivation on a wide range of substrates. In addition, a temperature control module on 300LC allows temperature monitoring and compensation of the etching and CMP processes. MAXIS 300LC is capable of supporting complex multi-step edge processes, providing maximum process control and uniformity. The model is designed for repeatable results, allowing for consistent and reliable etching and CMP processes. The equipment is also equipped with an atmospheric control module, with adjustable pressure and oxygen levels for precise process control. Overall, 300LC etcher/asher is a powerful and versatile etching and CMP system that can handle a wide range of substrates and processes. It offers superior performance, precise process control, and repeatable results. It is an ideal solution for etching and CMP applications in semiconductor fabrication, research and development, and other industries.
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