Used MRC RIE-51 #9382964 for sale

MRC RIE-51 is a advanced plasma etcher/asher that offers a large process capability, providing significant advantages and flexibility for etching and ashing processes. With a modular design and wide range of process and options, RIE-51 is suitable for advanced dry etching and ashing processes in a variety of industries and high-end research environments. MRC RIE-51's modular design allows for customization of all etch process chamber components for maximum process flexibility, efficiency and repeatability. With a chamber temperature up to 400°C and a pressure range from 0.1 to 2.0 torr, the process capability of the equipment covers an exceptionally wide array of applications. It is compatible with most gas chemistries and has high-performance gas introduction filtration and superior gas flow control. The high vacuum pump provides rapid and precise vacuum pumping as well as low maintenance. An integrated, intuitive control system provides efficient process control, temperature & pressure monitoring, and overall unit monitoring. Additionally, the advanced safety features ensure operator safety. The etch source is divided into two zones, where numerous parameters such as pressure, temperature, and flow are independently controlled. It also features optimally matched radio frequency (RF) heating, etching and pre-bias techniques. This allows users to custom-tailor the etch process to their specific needs. RIE-51 also offers advanced cleaning capabilities, including both wet and dry cleaning. A wide range of options are available for wet cleaning, including single- or dual-step cleaning with varied chemistries for maximum cleaning efficiency. Advanced dry cleaning options like the Plasma Tone cleaning, degas, and quench are available for the most challenging soft or hard material etching tasks. MRC RIE-51's outstanding repeatability and high process capability make it suitable for a wide range of applications, including wafer etching and ashing, MEMS fabrication, advanced SOI device fabrication and many more. also features advanced technology options, including hydrogen termination, thermal coat removal, and variable frequency etch capability. The combination of modularity and advanced options allows users to tailor the machine to fit their needs and make it an efficient, cost-effective solution.