Used NOVELLUS Vector #9195888 for sale

NOVELLUS Vector is a high-precision etcher/asher, specifically designed for wafer level processing of semiconductor materials. It is a highly advanced equipment that can be used for both plasma and thermal etching processes. Vector is capable of producing very small, precisely shaped patterns on thin films but also offers flexible scalability and throughput. It provides a flexible platform for plasma etching and ashing processes. NOVELLUS Vector's advanced hardware, software, and optics technology helps deliver high-performance ashing, etching, and cleaning. Its Thin Film Ashing Module (TFAM) is a vacuum chamber designed for specific applications that require special features like high-resolution, low-energy, and low-temperature ashing. Vector's Mainframe Chamber provides a robust and durable thermal etch process with maximum flexibility. NOVELLUS Vector's high-resolution Mask Alignment system allows for precise placement of products and masks within the chamber. Vector also provides advanced automation of the etch and asher processes. It offers built-in repeatability with the automatic detection of chamber conditions, product characteristics, and process parameters. NOVELLUS Vector's software includes a powerful graphic user interface (GUI) which provides an easy-to-use platform for remote operation, data acquisition, and diagnostics. Vector's multi-cassette loading unit expands throughput capabilities and lowers operating costs. Its Vacuum Management Machine (VMS) helps in the control of particle levels and provides higher performance for etch/ashing processes. Additionally, NOVELLUS Vector features an intuitive and user-friendly and an enhanced load-locking tool for reduced wafer damage. Vector's plasma etch and asher options provide consistently high-performance with low cycle times. Furthermore, NOVELLUS Vector ensures an environmentally friendly processing atmosphere with its low-energy source. Overall, Vector is a very versatile etch/asher with high-precision capabilities, excellent scalability, and high throughput for demanding wafer level processes.