Used OCCLEPPO 650-06-P-25 #9003041 for sale

OCCLEPPO 650-06-P-25 is a high performance etching and ashing equipment designed for the precision etching and ashing of semiconductor wafers. 650-06-P-25 etches and ashes wafers using high vacuum DC magnetron sputtering of an inert gas. This process allows for the precise deposition of materials in a controlled and uniform fashion. OCCLEPPO 650-06-P-25 has a process chamber capable of etching and ashing up to 150 mm diameter wafers. The process chamber is equipped with an automated cassette to cassette transfer, built-in computerized control, and a two-way high vacuum gate valve. The DC magnetron sputtering system includes three independent power supplies with a total of six cathodes, and a total of eight sputter sources. The process chamber is controlled by a series of process and temperature controllers. 650-06-P-25 has multiple built-in safety features including an automated gas intensity control unit, a low-pressure process chamber with atmosphere purge, an ionized gas plasma cleaning regime, and an automated chamber cleaning cycle. OCCLEPPO 650-06-P-25 is built to meet the requirements for a small footprint, low cost operation, and high performance etching and ashing. 650-06-P-25 is an advanced etching and ashing machine with a wide range of processing capabilities. It is suitable for a wide range of materials and processes, including etching and ashing of silicon, aluminum, gold, diamond films, and various photoresist processes. It is also suitable for etching and ashing of complex geometries including MEMS structures, 3D surfaces and nanofabricated structures. OCCLEPPO 650-06-P-25 is capable of achieving high accuracy deposition, with feature sizes as small as 10 nm. With its high precision DC magnetron sputtering, high process homogeneity, and repeatable and reliable results, 650-06-P-25 is ideal for demanding microfabrication processes. OCCLEPPO 650-06-P-25 also has an easy to use software interface and is CE certified for use in the European Union.