Used OXFORD INSTRUMENTS Opal #293759975 for sale
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ID: 293759975
Wafer Size: 4"
Vintage: 2015
Plasma Enhanced Atomic Layer Deposition (PEALD) system, 4"
Mass Flow Controller 1: H2 50 SCCM
Mass Flow Controller 2: NH3 100 SCCM
Mass Flow Controller 3: N2 100 SCCM
Mass Flow Controller 4: O2 100 SCCM
Mass Flow Controller 5: Ar 100 SCCM
Substrate holder: 240 mm resistance-heated (up to 400°C)
Remote Plasma source: 300 W Capacity at 13.56 MHz (RF generator and automatic matching unit)
Metal precursors delivery: (2) Bubblers and (2) vapor drawns
Gas lines: Non-toxic gas lines (3 lines) and toxic gas lines (2 lines) with individual Mass Flow Controller (MFC)
Water delivery kit
Ozone generator
Vacuum gauges: 1000mT CM gauge and Penning
Pumping pipe work: 40 mm (heating kit)
Materials tested: Al2O3 films only with Ar, O2, TMA
TMA Precursor
Silicon wafer
PC
Operating system: Windows 7 Pro
2015 vintage.
OXFORD INSTRUMENTS Opal is a cutting-edge plasma etcher/asher equipment designed to deliver advanced processing capabilities for a wide range of applications in the semiconductor, MEMS, and nanotechnology industries. This innovative system combines state-of-the-art technology with precision control to achieve highly accurate and uniform etching and ashing of various materials, making it an indispensable tool for research and development laboratories, as well as production environments. Opal unit utilizes a high-density plasma source to generate an energetic plasma that effectively removes material from substrates through a combination of chemical and physical processes. This plasma source is powered by advanced radio frequency (RF) plasma technology, which enables precise tuning of plasma parameters such as density, temperature, and ion energy to optimize etching and ashing performance on different materials. One of the key features of OXFORD INSTRUMENTS Opal is its advanced process control capabilities, which allow users to define and monitor key process parameters in real-time. The machine is equipped with a user-friendly interface that provides access to a wide range of process recipes and allows for easy customization of process parameters to meet specific requirements. This level of control enables users to achieve high process repeatability and reliability, ensuring consistent results batch after batch. Opal tool also offers a high degree of flexibility, with the ability to process various substrate sizes and types, including silicon, glass, III-V materials, polymers, and more. The asset is equipped with a versatile wafer chuck design that accommodates different wafer sizes and shapes, and can handle both single wafer and batch processing modes to meet the needs of different applications. In terms of etching capabilities, OXFORD INSTRUMENTS Opal model excels in achieving high etch rates and selectivity on a wide range of materials, making it ideal for applications such as pattern transfer, material removal, and device fabrication. The equipment is capable of producing highly anisotropic etch profiles with high aspect ratios, enabling the fabrication of complex microstructures with high precision and fidelity. Additionally, Opal system is equipped with advanced ashing capabilities for the removal of organic contaminants and photoresist residues from substrates. The unit's high-density plasma source effectively breaks down organic materials and volatile compounds, leaving behind clean and residue-free surfaces without damage to the underlying substrate. Overall, OXFORD INSTRUMENTS Opal is a cutting-edge plasma etcher/asher machine that offers unparalleled performance, precision control, and process flexibility for a wide range of nanotechnology applications. With its advanced technology and innovative design, Opal tool is a powerful tool for researchers and manufacturers looking to achieve high-quality and reliable processing results in their semiconductor and microfabrication processes.
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