Used OXFORD INSTRUMENTS PlasmaLab 80 Plus #293824941 for sale

ID: 293824941
Wafer Size: 4"-6"
Vintage: 1995
PECVD System, 4"-6" Deposits: SiO2 & SiH4 Control PC EDWARDS E2M80 Vacuum pump RF Generator No burner gas abatement No silane MFC Gases: SiO2, SiH4 Temperature range: 300 °C 1995 vintage.
OXFORD INSTRUMENTS PlasmaLab 80 Plus is a highly advanced plasma etcher/asher equipment designed for precise and efficient processing of a wide range of samples in research and production environments. Built on the foundation of OXFORD INSTRUMENTS renowned expertise in plasma processing technology, PlasmaLab 80 Plus incorporates cutting-edge features and innovative design elements to deliver superior performance and flexibility. At the heart of OXFORD INSTRUMENTS PlasmaLab 80 Plus is its high-density plasma source, which generates a uniform and stable plasma capable of delivering highly anisotropic etching/ashing profiles with exceptional selectivity and process control. The system is equipped with multiple gas injection ports and a sophisticated gas delivery unit, allowing users to tailor the process parameters to achieve the desired etching characteristics for different materials and structures. PlasmaLab 80 Plus features a spacious process chamber with a large wafer handling capability, enabling the processing of multiple samples in a single run for high throughput applications. The chamber is equipped with advanced temperature control and pressure regulation systems to maintain the process conditions at optimal levels throughout the etching/ashing cycle, ensuring reproducible results and excellent uniformity across the sample surface. One of the key strengths of OXFORD INSTRUMENTS PlasmaLab 80 Plus is its advanced process monitoring and control capabilities. The machine is equipped with a comprehensive suite of in-situ diagnostic tools, including optical emission spectroscopy (OES), mass spectrometry, and laser interferometry, allowing real-time monitoring of the plasma parameters and gas chemistry during the processing. This enables users to optimize the process conditions on-the-fly and make adjustments to achieve the desired etching results. Moreover, PlasmaLab 80 Plus is fully integrated with OXFORD INSTRUMENTS intuitive process control software, which provides a user-friendly interface for setting up process recipes, monitoring the process parameters, and analyzing the data in real-time. The software also offers advanced data logging and analysis tools for comprehensive process optimization and quality control. In addition to its advanced capabilities in plasma etching/ashing, OXFORD INSTRUMENTS PlasmaLab 80 Plus can be easily configured for a wide range of applications, including reactive ion etching (RIE), deep silicon etching, polymer removal, and surface modification. The tool supports a variety of process gases, such as CF4, SF6, O2, Ar, and Cl2, making it suitable for processing a diverse range of materials, including silicon, silicon dioxide, metals, polymers, and compound semiconductors. Overall, PlasmaLab 80 Plus is a versatile and powerful plasma etcher/asher asset that offers unmatched performance, flexibility, and control for demanding research and production applications. With its advanced features, intuitive software interface, and robust design, OXFORD INSTRUMENTS PlasmaLab 80 Plus is an indispensable tool for achieving high-quality etching results and accelerating innovation in semiconductor device fabrication, MEMS/NEMS development, and advanced materials research.
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