Used OXFORD INSTRUMENTS PlasmaLab 80 Plus #293824942 for sale
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ID: 293824942
Wafer Size: 4"-6"
Vintage: 1998
PECVD System, 4"-6"
Control PC
Burner gas abatement
EDWARDS E2M80 Vacuum pump
Deposits: SiO2, SiH4, Amorphous Si
Temperature range: 300 °C
RF Generator
MFCs
1998 vintage.
OXFORD INSTRUMENTS PlasmaLab 80 Plus is a advanced plasma etcher/asher equipment designed for precision etching and ashing processes in the semiconductor industry and other materials research applications. This high-performance tool incorporates state-of-the-art technologies to deliver superior process control, uniformity, and repeatability for a wide range of materials and device structures. PlasmaLab 80 Plus features a versatile dual-source RF plasma system that enables both etching and gas-phase surface modification processes. Its advanced plasma generation unit utilizes a combination of RF power supplies and matching networks to create high-density, low-pressure plasmas that are well-suited for etching a variety of materials, including silicon, III-V compounds, metals, dielectrics, and polymers. One of the key advantages of OXFORD INSTRUMENTS PlasmaLab 80 Plus is its dual-source configuration, which allows for the use of different gases and process chemistries to achieve a wide range of etch and ash results. The machine is equipped with multiple gas inputs and mass flow controllers, enabling precise control over the composition and flow rates of process gases. This flexibility enables users to tailor the plasma chemistry to meet specific process requirements, such as etch selectivity, sidewall profile control, and etch rate optimization. PlasmaLab 80 Plus features a high-performance electrostatic chuck (ESC) with temperature control capabilities, providing excellent substrate stability and uniformity during processing. The ESC can accommodate a variety of substrate sizes and types, including wafers, pieces, and irregularly shaped samples. Additionally, the tool incorporates a reactive ion etching (RIE) configuration with a dedicated RF bias power supply for precise control over ion energy and directionality, enabling deep and anisotropic etching capabilities. OXFORD INSTRUMENTS PlasmaLab 80 Plus is equipped with a sophisticated process control asset that allows for real-time monitoring and adjustment of key process parameters, such as gas flow rates, pressure, RF power, and temperature. The model software provides a user-friendly interface for recipe creation, data logging, and process optimization, enabling users to easily develop and transfer recipes between different tool configurations or laboratories. In terms of performance, PlasmaLab 80 Plus offers high etch and ash rates, excellent uniformity and repeatability, and low damage to sensitive materials. The equipment's advanced endpoint detection capabilities ensure precise process control and consistent results across multiple runs. Additionally, the tool's automated cleaning and maintenance routines help to minimize downtime and ensure optimal system performance over time. Overall, OXFORD INSTRUMENTS PlasmaLab 80 Plus is a sophisticated plasma etcher/asher unit that offers unmatched process control, flexibility, and performance for a wide range of applications in the semiconductor industry and materials research field. With its advanced technology and user-friendly interface, PlasmaLab 80 Plus is an essential tool for researchers and engineers looking to achieve precise and reliable etching and ashing results.
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