Used OXFORD INSTRUMENTS Plasmalab 800 Plus #293831458 for sale

OXFORD INSTRUMENTS Plasmalab 800 Plus is a sophisticated plasma etching/ashing equipment that is designed for advanced semiconductor processing applications. This tool offers precise control over etching parameters to achieve high-quality, uniform etching results on a variety of substrate materials. With its advanced technology and innovative features, Plasmalab 800 Plus is a versatile tool for research and development in the fields of microelectronics, MEMS (Micro-Electro-Mechanical Systems), optoelectronics, and nanotechnology. OXFORD INSTRUMENTS Plasmalab 800 Plus features a dual-frequency plasma source that provides enhanced process flexibility and control. The system is equipped with both inductive (ICP) and capacitive (CCP) plasma sources, allowing users to tailor the plasma characteristics to meet specific processing requirements. The dual-source configuration enables a wide range of plasma chemistries and process conditions, making the unit suitable for a diverse range of etching and ashing applications. One of the key strengths of Plasmalab 800 Plus is its advanced process control capabilities. The machine comes with a comprehensive set of software tools that allow users to monitor and adjust process parameters in real-time. This includes control over gas flow rates, pressure, RF power, bias voltage, and temperature. The tool also features automatic endpoint detection and control, which ensures precise etch depths and endpoint detection for each process step. OXFORD INSTRUMENTS Plasmalab 800 Plus offers a high degree of process uniformity and repeatability, thanks to its advanced wafer handling asset and chamber design. The model is equipped with a robust vacuum load lock mechanism, which ensures fast and reliable wafer loading and unloading without compromising process quality. The chamber design incorporates advanced gas distribution and plasma confinement features, which help to achieve uniform etching results across the entire wafer surface. Plasmalab 800 Plus supports a wide range of etching processes, including reactive ion etching (RIE), deep reactive ion etching (DRIE), plasma-enhanced chemical vapor deposition (PECVD), and plasma cleaning/ashing. The equipment is capable of etching various materials, such as silicon, silicon dioxide, silicon nitride, metals, polymers, and compound semiconductors. This versatility makes OXFORD INSTRUMENTS Plasmalab 800 Plus an ideal tool for fabricating complex microstructures and devices with high aspect ratios and fine feature sizes. In addition to its processing capabilities, Plasmalab 800 Plus offers a user-friendly interface that simplifies operation and maintenance. The system features intuitive software control and monitoring interfaces, which allow users to set up and run processes with minimal training. The unit also includes built-in diagnostic tools for troubleshooting and preventive maintenance, ensuring maximum uptime and productivity. Overall, OXFORD INSTRUMENTS Plasmalab 800 Plus is a state-of-the-art plasma etching/ashing machine that offers precision control, process flexibility, and high performance for demanding semiconductor research and development applications. Its advanced technology, process control features, and user-friendly interface make it a valuable tool for academic and industrial users working in the fields of microelectronics, MEMS, optoelectronics, and nanotechnology.