Used OXFORD Micro-dep 300 #293740502 for sale

OXFORD Micro-dep 300 is a cutting-edge etcher/asher equipment widely utilized in various industries including semiconductors, microelectronics, MEMS, and photonics for precise material removal processes. This state-of-the-art equipment offers exceptional performance, repeatability, and process control, making it a preferred choice for research and development as well as high-volume production applications. One of the key features of Micro-dep 300 is its advanced plasma processing capabilities, which allow for precise and uniform etching/ashing of various materials such as silicon, silicon dioxide, silicon nitride, metals, and dielectric layers. This system operates based on the principles of reactive ion etching (RIE) and plasma-enhanced chemical vapor deposition (PECVD), enabling users to achieve highly anisotropic etch profiles with minimal sidewall roughness and excellent selectivity. OXFORD Micro-dep 300 is equipped with a robust vacuum chamber, high-power RF plasma source, gas delivery unit, and precise temperature control mechanisms to create a highly controlled process environment. The vacuum chamber ensures low-pressure conditions for plasma generation, while the RF plasma source efficiently excites the process gases to create an energetic plasma. The gas delivery machine enables precise control of etchant gases such as SF6, CF4, O2, and Ar, allowing users to tailor the etching chemistry according to their specific requirements. Furthermore, Micro-dep 300 features advanced plasma diagnostics tools such as optical emission spectroscopy (OES) and mass spectrometry to monitor and analyze the plasma characteristics in real-time. This capability enables users to optimize process parameters, achieve desired etch rates, selectivities, and uniformity, and troubleshoot any process issues efficiently. The tool also incorporates a user-friendly interface with intuitive software control for easy operation and recipe management. Users can program and store multiple process recipes, adjust key parameters such as power, pressure, gas flow rates, and temperature, and monitor process progress through a graphical user interface. Additionally, OXFORD Micro-dep 300 offers comprehensive data logging and analysis tools, allowing users to track process trends, identify deviations, and optimize process performance for enhanced productivity and yield. In terms of performance, Micro-dep 300 delivers high etch rates, excellent uniformity across the wafer, and superior etch selectivity, making it suitable for a wide range of applications requiring precise material removal. Whether it's via ion bombardment for physical etching or reactive species for chemical etching, the asset provides users with the flexibility to achieve desired etch profiles and surface finishes. Overall, OXFORD Micro-dep 300 is a versatile and reliable etcher/asher model that meets the stringent requirements of modern semiconductor and microelectronics fabrication processes. With its advanced plasma processing capabilities, precise control, and user-friendly interface, this equipment enables researchers and manufacturers to achieve superior process results, optimize device performance, and drive innovation in the field of advanced materials processing.