Used OXFORD Plasmalab 100-ICP 180 #293807546 for sale

OXFORD Plasmalab 100-ICP 180 is a highly advanced etcher/asher manufactured by OXFORD Instruments. It is designed for the purpose of large-area and deep-etching high electron-mobility transistors (HEMTs), advanced microelectronic chips, and wafer-level equipment integration. This system offers complete control over the etch and ashing parameters such as etch time and size, direction, power, pressure, and gas purity with a direct-drive wafer handling unit ensuring results of the highest accuracy and efficiency. OXFORD PLASMALAB 100 / ICP 180 is equipped with a high-efficiency, high-power Inductively Coupled Plasma (ICP) source that is able to generate a short duration plasma pulse that creates ionized particles. This feature reduces the etch rate slow down which would normally be seen when etching large areas. Moreover, it offers superior uniformity of etching across the whole wafer surface. Plasmalab 100-ICP 180 also possesses a wafer-level sink cooling machine. This allows for a rapid cooling process that gathers the waste heat produced by the etch process, thus guaranteeing the materials' integrity during the procedure. Furthermore, it provides excellent etching angles and dimensional accuracy across the entire wafer. When it comes to etching gases, PLASMALAB 100 / ICP 180 offers a range of precise mixtures composed of, but not limited to, hydrogen fluoride/carbon dioxide mixtures, SF6/SF4 mixtures, and boron trifluoride/argon mixtures. This enables the user to achieve high uniformity of etch rate along the wafer line, achieving improved feature accuracy and also sharper profile edges. In order to provide accurate results, OXFORD Plasmalab 100-ICP 180 is equipped with an advanced pressure control and vacuum chamber monitoring systems. These systems allow for precise control over the pressure in the chamber, which in turn ensures greater process accuracy and repeatability. Overall, OXFORD Instruments OXFORD PLASMALAB 100 / ICP 180 is an ideal etcher/asher that guarantees perfect process control and repeatability - enabling the user to achieve both speed and precision when performing etch/ash applications.