Used OXFORD Plasmalab 100 #293772814 for sale

OXFORD Plasmalab 100 is a highly advanced plasma etcher/asher equipment designed for precision etching and ashing processes in semiconductor manufacturing and research applications. This state-of-the-art tool offers exceptional process flexibility, reliability, and repeatability, making it an ideal choice for a wide range of plasma processing requirements. At the heart of Plasmalab 100 is a sophisticated plasma source that generates a high-density, uniform plasma to facilitate efficient etching and removal of material from semiconductor samples. The system is equipped with multiple gas inputs, allowing for the precise control of process gases and parameters to achieve the desired etch rates, selectivity, and uniformity across the sample surface. OXFORD Plasmalab 100 features a versatile chamber design that accommodates various sample sizes and shapes, enabling users to process a wide range of materials with different dimensions and geometries. The unit's advanced vacuum machine ensures rapid pump-down times and a high degree of process stability, contributing to improved process reproducibility and overall productivity. One of the key strengths of Plasmalab 100 is its intuitive user interface, which provides operators with easy access to a comprehensive range of process recipes and parameters. The tool's software allows for real-time monitoring and control of key process parameters such as gas flow rates, pressure, power, and temperature, enabling users to fine-tune process conditions for optimal results. OXFORD Plasmalab 100 offers a range of plasma etching and asher capabilities, including reactive ion etching (RIE), inductively coupled plasma (ICP) etching, and plasma cleaning/ashing. These processes can be carried out with high precision and repeatability, making the asset suitable for applications such as pattern transfer, device fabrication, surface cleaning, and material removal. The model's advanced RF power supply and matching network ensure stable plasma generation and uniform processing across the entire sample area. Plasmalab 100 also features advanced gas delivery and mixing systems that enable precise control over the chemistry of the plasma, facilitating the customization of etch processes to meet specific requirements. In addition to its exceptional performance and flexibility, OXFORD Plasmalab 100 is designed with user safety and environmental considerations in mind. The equipment incorporates various safety interlocks and alarms to prevent operator exposure to hazardous chemicals and high voltages, ensuring a high level of operational safety during plasma processing. Overall, Plasmalab 100 is a cutting-edge tool that combines advanced plasma processing capabilities with user-friendly operation, making it an essential asset for semiconductor research and production facilities seeking to achieve high-quality, reliable etching and asher processes. Its versatility, precision, and robust design set it apart as a top-of-the-line solution for demanding plasma processing applications in the semiconductor industry.